mc9s12uf32 Freescale Semiconductor, Inc, mc9s12uf32 Datasheet - Page 125

• Manufacturer Part Number: mc9s12uf32
• Description: System Chip Guide V01.05
• Manufacturer: Freescale Semiconductor, Inc

B.3 64-pin LQFP Package
Freescale Semiconductor
C L
VIEW Y
H
C
3X
SEATING
PLANE
AB
AB
A
A
Figure B-2 64-pin LQFP mechanical dimensions (case no. 840F)
16
1
4X
VIEW Y
64
17
0.2 H A–B D
D/2
D1/2
X=A, B OR D
X
D1
D
60X
e/2
e
4X
4X
D
( 2)
( 3)
49
32
PLATING
48
33
4X 16 TIPS
B
E1/2
c
0.2 C A–B D
VIEW AA
ROTATED 90 CLOCKWISE
SECTION AB–AB
E/2
0.08
0.08 C
E1
System on a Chip Guide — 9S12UF32DGV1/D V01.05
BASE METAL
M
b1
b
E
C
A–B
D
c1
A1
NOTES:
A2
1. ALL DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE H IS COINCIDENT WITH THE
4. DATUMS A, B AND D TO BE DETERMINED AT
5. DIMENSIONS D AND E TO BE DETERMINED AT
6. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD
7. DIMENSION b DOES NOT INCLUDE DAMBAR
VIEW AA
ANSI Y14.5M, 1982.
BOTTOM OF THE LEAD WHERE THE LEAD EXITS
THE PLASTIC BODY AT THE BOTTOM OF THE
PARTING LINE.
DATUM PLANE H.
SEATING PLANE C.
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
PER SIDE. DIMENSIONS D1 AND E1 DO INCLUDE
MOLD MISMATCH AND ARE DETERMINED AT
DATUM PLANE H.
PROTRUSION. THE DAMBAR PROTRUSION
SHALL NOT CAUSE THE b DIMENSION TO
EXCEED 0.35. MINIMUM SPACE BETWEEN
PROTRUSION AND ADJACENT LEAD OR
PROTRUSION 0.07.
(S)
0.05
DIM
(L2)
A1
A2
D1
E1
R1
b1
c1
L1
L2
A
b
c
D
e
E
L
S
1
2
3
MILLIMETERS
S
MIN
0.05
1.35
0.17
0.17
0.09
0.09
0.45
0.10
—
0
0
12.00 BSC
10.00 BSC
12.00 BSC
10.00 BSC
1.00 REF
0.50 REF
12 REF
12 REF
0.20 REF
0.50 BSC
(L)
1.60
0.15
1.45
0.27
0.23
0.20
0.16
0.75
0.20
MAX
L
—
7
1
GAGE PLANE
0.25
2X R
R1
125