sc16c2550b NXP Semiconductors, sc16c2550b Datasheet - Page 38

• Manufacturer Part Number: sc16c2550b
• Description: 5 V, 3.3 V And 2.5 V Dual Uart, 5 Mbit/s Max. , With 16-byte Fifos
• Manufacturer: NXP Semiconductors

NXP Semiconductors
SC16C2550B_4
Product data sheet
12.3.2 Wave soldering
Table 26.
Table 27.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
Fig 22. Temperature profiles for large and small components
2.5
MSL: Moisture Sensitivity Level
temperature
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
Figure
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs
Rev. 04 — 15 February 2007
22.
= minimum soldering temperature
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
3
3
)
)
350 to 2000
260
250
245
220
220
350
SC16C2550B
temperature
peak
> 2000
260
245
245
© NXP B.V. 2007. All rights reserved.
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