am49lv128bm Meet Spansion Inc., am49lv128bm Datasheet - Page 96
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am49lv128bm
Manufacturer Part Number
am49lv128bm
Description
Stacked Multi-chip Package Mcp ,128 Megabit 8 M ? 16-bit ,uniform Sector Flash Memory And 32 Mbit 2 M ? 16-bit Pseudo-static Ram With Page Mode Featuring Mirrorbit Technology,supplemental Datasheet
Manufacturer
Meet Spansion Inc.
Datasheet
1.AM49LV128BM.pdf
(98 pages)
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AM49LV128BM
Manufacturer:
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PHYSICAL DIMENSIONS
TLD064–64-Ball Fine-pitch Ball Grid Array
94
PACKAGE
SYMBOL
SD / SE
JEDEC
D x E
A
MD
ME
A1
A2
D1
E1
eE
eD
φb
A
D
E
n
CORNER
0.15
(2X)
PIN A1
A2
C1,C2,C9,C10,D1,D10,E1,E10
F1,F5,F6,F10,G1,G5,G6,G10
H1,H10,J1,J10,K1,K2,K9,K10
M2,M3,M4,M5,M6,M7,M8,M9
A1
C
0.10
0.81
0.35
B1,B2,B3,B4,B7,B8,B9,B10
MIN
A2,A3,A4,A5,A6,A7,A8,A9
L1,L2,L3,L4,L7,L8,L9,L10
---
64X
12.00 mm x 9.00 mm
0.15
0.08
12.00 BSC.
PACKAGE
INDEX MARK
9.00 BSC.
8.80 BSC.
7.20 BSC.
0.80 BSC.
0.40 BSC.
0.80 BSC
TLD 064
6
NOM
b
N/A
12
10
64
---
---
---
---
M
M
10
C A B
C
SIDE VIEW
TOP VIEW
MAX
1.20
0.97
0.45
---
D
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
NOTE
Am49LV128BM
C
0.15
A
(2X)
E
B
C
0.20 C
0.08
eE
C
10
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
eD
9
8
7
6
5
4
3
2
1
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
N/A
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
M L
K
SD
BOTTOM VIEW
7
J
H
G
D1
F
E
D C
B
A
SE
CORNER
PIN A1
June 17, 2004
3309 \ 16-038.22a
7
E1
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