mt9v112 Micron Semiconductor Products, mt9v112 Datasheet - Page 57

• Manufacturer Part Number: mt9v112
• Description: 1/6-inch Soc Vga Cmos Digital Image Sensor
• Manufacturer: Micron Semiconductor Products

NOTE:
Data Sheet Designation
terization of production devices.
09005aef8154a39d/09005aef8175e6cc
MT9V112_2.fm - Rev. A 1/05 EN
DIMENSIONS APPLY TO
SOLDER BALLS POST
REFLOW. THE PRE-REFLOW
DIAMETER IS Ø0.33
SEATING PLANE
E-mail: [e-mail], Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
All dimensions in millimeters.
Preliminary This data sheet contains initial characterization limits that are subject to change upon full charac-
36X Ø0.35
3.75
0.10
1.875
SOLDER BALL MATERIAL:
A
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc.
1.875
5.80 ±0.075
SUBSTRATE MATERIAL: PLASTIC LAMINATE
3.75
BALL PADS Ø 0.27 SOLDER MASK DEFINED
BALL A6
0.75 TYP
C L
(FOR REFERENCE ONLY)
All other trademarks are the property of their respective owners.
2.90 ±0.05
Figure 25: 36-Ball ICSP Package
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3% Ag, 0.5% Cu
ENCAPSULANT: EPOXY
BALL A1
0.22
(FOR REFERENCE ONLY)
C L
2.90 ±0.05
0.75 TYP
BALL A1 ID
0.375 ±0.075
5.80 ±0.075
0.575 ±0.050
0.95 (FOR REFERENCE ONLY)
1.17 ±0.10
B
0.175
57
SOC VGA DIGITAL IMAGE SENSOR
®
(FOR REFERENCE ONLY)
Micron Technology, Inc., reserves the right to change products or specificat ions wit hout not ice.
OPTICAL AREA
MAXIMUM ROTATION OF OPTICAL AREA RELATIVE TO PACKAGE EDGES: 1º
MAXIMUM TILT OF OPTICAL AREA RELATIVE TO
MAXIMUM TILT OF OPTICAL AREA RELATIVE TO TOP OF COVER GLASS: 0.3º.
PACKAGE CENTER
OPTICAL CENTER
LID MATERIAL: BOROSILICATE GLASS 0.40 THICKNESS
IMAGE SENSOR DIE
2.714 ±0.075
BALL A1
CORNER
0.186
2.900 ±0.075
©2004 Micron Technology, Inc. All rights reserved.
2.304 CTR
4.00
CTR
PRELIMINARY
B
MT9V112
0.3º.
1.728
PIXEL
(0,0)
CTR
4.00
CTR