k4r881869e Samsung Semiconductor, Inc., k4r881869e Datasheet - Page 20

• Manufacturer Part Number: k4r881869e
• Description: 288mbit Rdram 512k X 18bit X 32s Banks
• Manufacturer: Samsung Semiconductor, Inc.

K4R881869E
Center-Bonded WBGA Package
(92balls)
Figure 4 shows the form and dimensions of the recom-
mended package for the 92balls center-bonded WBGA
device class.
Table lists the numerical values corresponding to dimen-
sions shown in Figure 4.
E1
10
1
2
3
4
5
6
7
8
9
Figure 4: Center-Bonded WBGA Package
A
e1
e2
A
D
E
E1
d
B
Symbol
C
D
E
Ball pitch (x-axis)
Ball pitch (y-axis)
Package body length
Package body width
Package total thickness
Ball height
Ball diameter
F
Table 19 : Center-Bonded WBGA Package Dimensions
D
G H
d
Parameter
J
e1
K
L M N
Page 18
P
15.00
Min.
0.80
0.80
9.20
0.90
0.30
0.40
R
S
T
U
15.20
Version 1.4 Dec. 2003
Max
0.80
0.80
9.40
1.00
0.40
0.50
Bottom
Bottom
e2
.
Direct RDRAM
A
Bottom
E
Unit
mm
mm
mm
mm
mm
mm
mm
Top
™