hsd2m64b2 ETC-unknow, hsd2m64b2 Datasheet

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hsd2m64b2

Manufacturer Part Number
hsd2m64b2
Description
Synchronous Dram Module 16mbyte 2mx64-bit , So-dimm, 4banks, Ref., 3.3v
Manufacturer
ETC-unknow
Datasheet
HANBit
GENERAL DESCRIPTION
two CMOS 512K x 32 bit with 4banks Synchronous DRAMs in TSOP-II 400mil packages on a 144-pin glass-epoxy
substrate. Two 0.1uF decoupling capacitors are mounted on the printed circuit board in parallel for each SDRAM. The
HSD2M64B2 is a SO-DIMM(Small Outline Dual in line Memory Module) and is intended for mounting into 144-pin edge
connector sockets. Synchronous design allows precise cycle control with the use of system clock. I/O transactions are
possible on every clock cycle. Range of operating frequencies, programmable latencies allows the same device to be
useful for a variety of high bandwidth, high performance memory system applications All module components may be
powered from a single 3.3V DC power supply and all inputs and outputs are LVTTL-compatible.
FEATURES
• Part Identification
• Burst mode operation
• Auto & self refresh capability (4096 Cycles/64ms)
• LVTTL compatible inputs and outputs
• Single 3.3V 0.3V power supply
• MRS cycle with address key programs
• JEDEC standard 144-Pin SO-DIMM
• All inputs are sampled at the positive going edge of the system clock
• The used device is 512Kx32Bitx4Banks SDRAM
URL:www.hbe.co.kr
REV.1.0 (August.2002)
The HSD2M64B2 is a 2M x 64 bit Synchronous Dynamic RAM high density memory module. The module consists of
- Latency (Access from column address)
- Burst length (1, 2, 4, 8 & Full page)
- Data scramble (Sequential & Interleave)
HSD2M64B2-F/10 :100MHz
HSD2M64B2-F/8 :125MHz
* F : Auto Self-Refresh with Low Power
Synchronous DRAM Module 16Mbyte (2Mx64-Bit), SO-DIMM,
4Banks, 4K Ref., 3.3V
1
Part No. HSD2M64B2
HANBit Electronics Co.,Ltd.
HSD2M64B2

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hsd2m64b2 Summary of contents

Page 1

... Ref., 3.3V GENERAL DESCRIPTION The HSD2M64B2 bit Synchronous Dynamic RAM high density memory module. The module consists of two CMOS 512K x 32 bit with 4banks Synchronous DRAMs in TSOP-II 400mil packages on a 144-pin glass-epoxy substrate. Two 0.1uF decoupling capacitors are mounted on the printed circuit board in parallel for each SDRAM. The HSD2M64B2 is a SO-DIMM(Small Outline Dual in line Memory Module) and is intended for mounting into 144-pin edge connector sockets ...

Page 2

... DQ49 133 87 DQ18 88 DQ50 135 89 DQ19 90 DQ51 137 91 Vss 92 Vss 139 93 DQ20 94 DQ52 141 95 DQ21 96 DQ53 143 2 HSD2M64B2 Symbol PIN Symbol DQ22 98 DQ54 DQ23 100 DQ55 VDD 102 VDD A6 104 A7 A8 106 BA0 Vss 108 Vss A9 110 BA1 A10_AP 112 A11 ...

Page 3

... DQ16-23,DQ48-55 RAS DQM2 CE WE A0-A12 BA0-1 DQM6 CKE CLK U4 CAS DQ24-31,DQ56-63 RAS DQM3 CE WE A0-A11 BA0-1 DQM7 Vcc Two 0.1uF Capacitors per each SDRAM Vss 3 HSD2M64B2 CLK0A DQM0 DQM4 DQM1 DQM5 CLK0B DQM2 DQM6 DQM3 DQM7 HANBit Electronics Co.,Ltd. ...

Page 4

... Blocks data input when DQM active. (Byte masking) Data inputs/outputs are multiplexed on the same pins. Power and ground for the input buffers and the core logic. SYMBOL V IN ,OUT Vcc STG HSD2M64B2 RATING -1V to 4.6V -1V to 4. 150 o C 100mA HANBit Electronics Co.,Ltd. ...

Page 5

... 0mA O CKE V (max =10ns CC CKE & CLK V (max CKE V (min) IH CS* V (min), t =10ns IH CC Input signals are changed one time during 20ns 5 HSD2M64B2 UNIT NOTE -2mA 2mA MAX UNITS 4.0 pF 4.5 pF 4.5 pF 6.5 pF VERSION UNIT ...

Page 6

... Input signals are stable Page burst 4Banks Activated t = 2CLKs CCD t t (min CKE 0. DDQ SSQ Value 2.4/0.4 1.4 tr/tf = 1/1 1.4 See Fig HSD2M64B2 150 130 mA 2 160 150 450 mA 5 UNIT HANBit Electronics Co.,Ltd. ...

Page 7

... RRD t (min (min (min) 6 RAS t (max) RAS (min) 9 tRC t (min) RDL t (min) CDL t (min) BDL t (min) CCD CAS latency=3 CAS latency=2 7 HSD2M64B2 V =1. Z0=50 50pF UNIT NOTE - 100 CLK 2.5 1 CLK 2 1 CLK ...

Page 8

... URL:www.hbe.co.kr REV.1.0 (August.2002) -8 -10 MIN MAX MIN MAX MIN 8 10 1000 2.5 2.5 3 3.5 3 3 HSD2M64B2 UNIT NOTE MAX MIN MAX 1000 1 HANBit Electronics Co.,Ltd. ...

Page 9

... (V=Valid, X=Don't care, H=Logic high, L=Logic low) 9 HSD2M64B2 BA A10/ 0,1 AP A9~A0 NOTE OP code 1 Row address L Column 4 V Address (A0 ~ A9) H 4,5 Column L Address 4 V (A0 ~ A9 ...

Page 10

... Gold: 1.04 0.10 mm Solder: 0.914 0.10 mm Org. Package Ref. 144 Pin 2Mx 64 4K SO-DIMM 144 Pin 2Mx 64 4K SO-DIMM 144 Pin 2Mx 64 4K SO-DIMM 144 Pin 2Mx 64 4K SO-DIMM 10 HSD2M64B2 1.0+ 0.1 mm Vcc Feature MAX.frq 3.3V 100MHz 3.3V Low Power 100MHz 3.3V 125MHz 3.3V Low Power 125MHz HANBit Electronics Co.,Ltd. ...

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