RF5110GPCBA-410 RFMD [RF Micro Devices], RF5110GPCBA-410 Datasheet - Page 15

• Manufacturer Part Number: RF5110GPCBA-410
• Description: 3V GSM POWER AMPLIFIER
• Manufacturer: RFMD [RF Micro Devices]

PCB Surface Finish
The PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. Typical thickness is
3μinch to 8μinch gold over 180μinch nickel.
PCB Land Pattern Recommendation
PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and
tested for optimized assembly at RFMD; however, it may require some modifications to address company specific
assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances.
PCB Metal Land Pattern
Figure 1. PCB Metal Land Pattern (Top View)
Rev A3 060814
0.50 Typ.
0.55 Typ.
PCB Design Requirements
0.55 Typ.
Pin 1
0.50 Typ.
Pin 16
A
A
A
A
A = 0.64 x 0.28 (mm) Typ.
B = 0.28 x 0.64 (mm) Typ.
C = 1.50 (mm) Sq.
B
B
1.50 Typ.
B
B
C
0.75 Typ.
B
B
B
B
Pin 8
Dimensions in mm.
A
A
A
A
Pin 12
0.75 Typ.
1.50
Typ.
RF5110G
2-15