PCF8811MU/2DA/1 PHILIPS [NXP Semiconductors], PCF8811MU/2DA/1 Datasheet - Page 62

• Manufacturer Part Number: PCF8811MU/2DA/1
• Description: 80 x 128 pixels matrix LCD driver
• Manufacturer: PHILIPS [NXP Semiconductors]

Philips Semiconductors
23 CHIP INFORMATION
The PCF8811 is manufactured in n-well CMOS technology. The substrate is at V
24 BONDING PAD LOCATIONS
Table 28 Bonding pad information
2004 May 17
handbook, halfpage
Pad pitch
Pad size (aluminium)
Bump dimensions
Wafer thickness (excluding
bumps)
80
2.31
mm
128 pixels matrix LCD driver
PAD
Fig.51 Chip size and pad pitch.
x
y
12.45 mm
PCF8811
min. 51.84
42.84
31.9
381 ( 25)
ROWS/COLS SIDE
pitch
100
105
MGW767
17.5 ( 5)
62
min. 54
50
34
handbook, halfpage
Fig.52 Shape of alignment mark (90 m diameter).
INTERFACE SIDE
100
95
17.5 ( 5)
y
center
SS
potential.
x
center
m
m
m
m
MGW768
Product specification
90
m
UNIT
PCF8811