PCF8811MU/2DA/1 PHILIPS [NXP Semiconductors], PCF8811MU/2DA/1 Datasheet - Page 72
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PCF8811MU/2DA/1
Manufacturer Part Number
PCF8811MU/2DA/1
Description
80 x 128 pixels matrix LCD driver
Manufacturer
PHILIPS [NXP Semiconductors]
Datasheet
1.PCF8811MU2DA1.pdf
(73 pages)
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Philips Semiconductors
Bare die
a period of ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be
separately indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips
Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die.
Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems
after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify
their application in which the die is used.
30 PURCHASE OF PHILIPS I
2004 May 17
80
128 pixels matrix LCD driver
All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for
Purchase of Philips I
components in the I
Philips. This specification can be ordered using the code 9398 393 40011.
2
C COMPONENTS
2
C system provided the system conforms to the I
2
C components conveys a license under the Philips’ I
72
2
C specification defined by
2
C patent to use the
Product specification
PCF8811
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