DAC1405D750HW NXP [NXP Semiconductors], DAC1405D750HW Datasheet - Page 37

• Manufacturer Part Number: DAC1405D750HW
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
11. Package outline
Fig 20. Package outline SOT638-1 (HTQFP100)
DAC1405D750_1
Preliminary data sheet
HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads;
body 14 x 14 x 1 mm; exposed die pad
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
E h
VERSION
OUTLINE
SOT638-1
max.
100
76
1.2
A
75
y
1
0.15
0.05
A 1
exposed die pad side
1.05
0.95
A 2
e
pin 1 index
0.25
A 3
IEC
b p
H D
0.27
0.17
b p
D h
D
0.20
0.09
w
c
M
All information provided in this document is subject to legal disclaimers.
D
14.1
13.9
JEDEC
MS-026
(1)
Z D
0
D h
REFERENCES
X
7.1
6.1
Rev. 01 — 10 March 2010
25
51
14.1
13.9
E
50
26
(1)
Dual 14-bit DAC, up to 750 Msps; 4× and 8× interpolating
Z E
E h
7.1
6.1
B
JEITA
b p
scale
w
e
v
v
M
0.5
c
M
M
e
B
A
E
A
16.15
15.85
H D
H E
16.15
15.85
H E
10 mm
A
A 2
L
1
A 1
detail X
0.75
0.45
L p
PROJECTION
0.2
EUROPEAN
DAC1405D750
v
0.08
w
0.08
y
© NXP B.V. 2010. All rights reserved.
Z D
1.15
0.85
ISSUE DATE
L
(1)
L p
03-04-07
05-02-02
Z E
1.15
0.85
SOT638-1
(1)
(A 3 )
7°
0°
θ
37 of 43
θ