ADSP-BF522 AD [Analog Devices], ADSP-BF522 Datasheet - Page 79

• Manufacturer Part Number: ADSP-BF522
• Description: Blackfin Embedded Processor
• Manufacturer: AD [Analog Devices]

Preliminary Technical Data
SURFACE MOUNT DESIGN
Table 63
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern
Standard.
Table 63. Surface Mount Design Supplement
Package
289-Ball CSP_BGA
208-Ball CSP_BGA
is provided as an aide to PCB design. For industry-
CORNER
A1 BALL
* 1.75
1.61
1.46
Ball Attach Type
Solder Mask Defined
Solder Mask Defined
* COMPLIANT TO JEDEC STANDARDS MO-205-AM WITH
EXCEPTION TO PACKAGE HEIGHT AND BALL DIAMETER.
DETAIL A
TOP VIEW
Rev. PrG | Page 79 of 80 | February 2009
17.10
17.00 SQ
16.90
Figure 77. 208-Ball CSP_BGA (BC-208-2)
SEATING
PLANE
BSC SQ
15.20
BSC
0.80
Solder Mask Opening
0.26 mm diameter
0.40 mm diameter
20
ADSP-BF522/523/524/525/526/527
19
DETAIL A
18
17
16
DIAMETER
15
BOTTOM VIEW
* 0.50
14
BALL
0.45
0.40
13
12
11
10
9
INDEX AREA
8
COPLANARITY
0.12
A1 CORNER
7
6
1.36
1.26
1.16
5
4
0.35 NOM
0.30 MIN
3
2
1
B
C
D
E
F
G
H
K
L
M
N
P
R
T
U
A
J
V
W
Y
0.35 mm diameter
0.50 mm diameter
Ball Pad Size