ADSP-BF537 AD [Analog Devices], ADSP-BF537 Datasheet - Page 58

• Manufacturer Part Number: ADSP-BF537
• Description: Blackfin Embedded Processor
• Manufacturer: AD [Analog Devices]

ADSP-BF534/ADSP-BF536/ADSP-BF537
THERMAL CHARACTERISTICS
To determine the junction temperature on the application
printed circuit board use:
where:
T
T
center of package.
P
the method to calculate P
Values of
circuit board design considerations.
order approximation of T
where:
T
Values of
circuit board design considerations when an external heat sink
is required.
Values of
circuit board design considerations.
In
with JEDEC standards JESD51-2 and JESD51-6, and the junc-
tion-to-board measurement complies with JESD51-8. Test
board and thermal via design comply with JEDEC standards
JESD51-9 (BGA). The junction-to-case measurement complies
with MIL-STD-883 (Method 1012.1). All measurements use a
2S2P JEDEC test board.
Industrial applications using the 208-ball BGA package require
thermal vias, to an embedded ground plane, in the PCB. Refer to
JEDEC standard JESD51-9 for printed circuit board thermal
ball land and thermal via design information.
Table 41. Thermal Characteristics (182-Ball BGA)
Parameter
D
J
CASE
A
JT
JA
JMA
JMA
JB
JC
= Junction temperature ( C)
JT
JT
JT
Table 41
= Power dissipation (see
= Ambient temperature ( C)
= From
= Case temperature ( C) measured by customer at top
JA
JC
JB
through
Table 41
are provided for package comparison and printed
are provided for package comparison and printed
are provided for package comparison and printed
Condition
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
T
Table
J
T
=
J
=
T
D
J
)
CASE
by the equation:
43, airflow measurements comply
T
Power Dissipation on Page 53
A
+
+
JA
JT
JA
P
can be used for a first
D
P
D
Typical
32.80
29.30
28.00
20.10
7.92
0.19
0.35
0.45
Rev. B | Page 58 of 68 | July 2006
Unit
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
for
Table 42. Thermal Characteristics (208-Ball BGA Without
Thermal Vias in PCB)
Table 43. Thermal Characteristics (208-Ball BGA with
Thermal Vias in PCB)
Parameter
Parameter
JA
JMA
JMA
JB
JC
JA
JMA
JMA
JB
JC
JT
JT
JT
JT
JT
JT
Condition
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
Condition
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
Typical
23.30
20.20
19.20
13.05
6.92
0.18
0.27
0.32
Typical
22.60
19.40
18.40
13.20
6.85
0.16
0.27
0.32
Unit
Unit
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W