SAA7108AE PHILIPS [NXP Semiconductors], SAA7108AE Datasheet - Page 92

• Manufacturer Part Number: SAA7108AE
• Description: HD-CODEC
• Manufacturer: PHILIPS [NXP Semiconductors]

Philips Semiconductors
13 THERMAL CHARACTERISTICS
Note
1. The overall R
14 CHARACTERISTICS OF THE DIGITAL VIDEO ENCODER PART
T
2004 Jun 29
SYMBOL
R
Supplies
V
V
V
I
I
Inputs
V
V
I
C
amb
DDA
DDD
LI
SYMBOL
DDA
DDIe
DD(DVO)
IL
IH
th(j-a)
i
HD-CODEC
ground pins must be connected to the power and ground layers directly. An ample copper area direct under the
SAA7108AE; SAA7109AE with a number of through-hole plating, which connect to the ground layer (four-layer
board: second layer), can also reduce the effective R
In addition the usage of soldering glue with a high thermal conductance after curing is recommended.
= 0 to 70 C (typical values measured at T
thermal resistance from junction to ambient
analog supply voltage
digital supply voltage
digital supply voltage
(DVO)
analog supply current
digital supply current
LOW-level input voltage
HIGH-level input voltage
input leakage current
input capacitance
th(j-a)
PARAMETER
value can vary depending on the board layout. To minimize the effective R
PARAMETER
note 1
note 2
V
1.8 V or 2.5 V; note 3
V
pins RESe, TMSe, TCKe,
TRSTe and TDIe
V
1.8 V or 2.5 V; note 3
V
pins RESe, TMSe, TCKe,
TRSTe and TDIe
clocks
data
I/Os at high-impedance
DD(DVO)
DD(DVO)
DD(DVO)
DD(DVO)
amb
CONDITIONS
= 25 C); unless otherwise specified.
= 1.1 V, 1.5 V,
= 3.3 V; note 3
= 1.1 V, 1.5 V,
= 3.3 V; note 3
th(j-a)
92
. Please do not use any solder-stop varnish under the chip.
in free air
CONDITIONS
3.15
3.15
1.045
1.425
1.71
2.375
3.135
1
1
V
2
2
0.1
0.5
0.5
DD(DVO)
MIN.
SAA7108AE; SAA7109AE
0.2
3.3
3.3
1.1
1.5
1.8
2.5
3.3
110
175
VALUE
TYP.
32
(1)
3.45
3.45
1.155
1.575
1.89
2.625
3.465
115
200
+0.2
+0.8
+0.8
V
V
V
10
10
10
10
th(j-a)
DD(DVO)
DD(DVO)
DDIe
Product specification
MAX.
+ 0.3
all power and
+ 0.1 V
+ 0.3 V
UNIT
K/W
V
V
V
V
V
V
V
mA
mA
V
V
V
V
pF
pF
pF
UNIT
A