SSTUB32866EC/S NXP [NXP Semiconductors], SSTUB32866EC/S Datasheet - Page 26
SSTUB32866EC/S
Manufacturer Part Number
SSTUB32866EC/S
Description
1.8 V 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer with parity for DDR2-800 RDIMM applications
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1.SSTUB32866ECS.pdf
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NXP Semiconductors
14. Abbreviations
SSTUB32866_4
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
Table 14.
Acronym
CMOS
DDR
DIMM
LVCMOS
PPO
PRR
RDIMM
SSTL
Fig 28. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
Abbreviations
All information provided in this document is subject to legal disclaimers.
Description
Complementary Metal Oxide Semiconductor
Double Data Rate
Dual In-line Memory Module
Low Voltage Complementary Metal Oxide Semiconductor
Partial Parity Out
Pulse Repetition Rate
Registered Dual In-line Memory Module
Stub Series Terminated Logic
Rev. 04 — 15 April 2010
= minimum soldering temperature
1.8 V DDR2-800 configurable registered buffer with parity
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
SSTUB32866
temperature
peak
© NXP B.V. 2010. All rights reserved.
001aac844
time
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