W25Q64DWSFIG WINBOND [Winbond], W25Q64DWSFIG Datasheet - Page 54

• Manufacturer Part Number: W25Q64DWSFIG
• Description: 1.8V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
• Manufacturer: WINBOND [Winbond]

(IO
(IO
CLK
/CS
DO
DI
0
1
)
)
Mode 3
Mode 0
*
= MSB
CLK
/CS
IO
IO
IO
IO
0
1
2
3
0
Mode 3
Mode 0
1
Instruction (ABh)
CLK
2
/CS
IO
IO
IO
IO
0
1
2
3
Figure 28d. Release Power-down / Device ID Instruction (QPI Mode)
Figure 28c. Release Power-down / Device ID Instruction (SPI Mode)
3
Instruction
Mode 3
Mode 0
4
ABh
0
High Impedance
Figure 28b. Release Power-down Instruction (QPI Mode)
5
1
6
X
X
X
X
Instruction
2
7
ABh
0
X
X
X
X
23
*
3 Dummy Bytes
3
8
1
22
3 Dummy Bytes
X
X
X
X
9
4
X
X
X
X
5
Power-down current
2
29
- 54 -
X
X
X
X
6
1
30
tRES1
X
X
X
X
0
31
7
Device ID
*
7
32
4
5
6
7
8
6
33
Power-down current
0
1
2
3
5
34
IOs switch from
Input to Output
Device ID
4
Mode 3
Mode 0
Stand-by current
35
tRES2
3
36
2
37
1
Power-down current
38
Stand-by current
0
Mode 3
Mode 0
W25Q64DW
tRES2
Mode 3
Mode 0
Stand-by current