W25Q64DWSFIG WINBOND [Winbond], W25Q64DWSFIG Datasheet - Page 55

• Manufacturer Part Number: W25Q64DWSFIG
• Description: 1.8V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
• Manufacturer: WINBOND [Winbond]

10.2.30 Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down / Device
ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device ID
instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code “90h”
followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond (EFh)
and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first as shown
in Figure 29. The Device ID values for the W25Q64DW is listed in Manufacturer and Device Identification
table. The instruction is completed by driving /CS high.
(IO
(IO
(IO
(IO
CLK
CLK
/CS
/CS
DO
DO
DI
DI
0
1
0
1
)
)
)
)
Mode 3
Mode 0
0
31
*
= MSB
32
33
Figure 29. Read Manufacturer / Device ID Instruction (SPI Mode)
Manufacturer ID (EFh)
0
34
1
35
Instruction (90h)
2
36
3
37
4
High Impedance
38
5
- 55 -
39
6
*
7
40
7
6
23
41
*
8
5
22
42
9
Publication Release Date: January 13, 2011
Device ID
Address (000000h)
4
21
43
10
3
44
2
45
3
28
1
46
2
29
Preliminary - Revision C
W25Q64DW
0
1
30
0
Mode 3
Mode 0
31