W25Q64DWSFIG WINBOND [Winbond], W25Q64DWSFIG Datasheet - Page 6

• Manufacturer Part Number: W25Q64DWSFIG
• Description: 1.8V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
• Manufacturer: WINBOND [Winbond]

*1 IO0 and IO1 are used for Standard and Dual SPI instructions
*2 IO0 – IO3 are used for Quad SPI/QPI instructions
3. PIN CONFIGURATION SOIC 208-MIL
4. PAD CONFIGURATION WSON 6X5-MM / 8X6-MM
5. PIN DESCRIPTION SOIC 208-MIL, WSON 6X5/8X6-MM
PIN NO.
1
2
3
4
5
6
7
8
/HOLD (IO3)
PIN NAME
/WP (IO2)
Figure 1b. W25Q64DW Pad Assignments, 8-pad WSON (Package Code ZP & ZE)
DO (IO1)
Figure 1a. W25Q64DW Pin Assignments, 8-pin SOIC 208-mil (Package Code SS)
DI (IO0)
/WP (IO
GND
VCC
DO (IO
CLK
/CS
GND
/WP (IO
DO (IO
/CS
1
2
)
)
GND
/CS
1
2
)
)
I/O
I/O
I/O
I/O
I/O
I
I
1
2
3
4
Top View
Top View
Chip Select Input
Data Output (Data Input Output 1)*
Write Protect Input ( Data Input Output 2)*
Ground
Data Input (Data Input Output 0)*
Serial Clock Input
Hold Input (Data Input Output 3)*
Power Supply
1
2
3
4
- 6 -
8
7
6
5
8
7
6
5
VCC
/HOLD (IO
CLK
DI (IO
FUNCTION
VCC
/HOLD (IO
CLK
DI (IO
0
)
2
1
0
3
1
)
)
3
W25Q64DW
)
2