W9751G6KB WINBOND [Winbond], W9751G6KB Datasheet - Page 86

• Manufacturer Part Number: W9751G6KB
• Description: 8M ? 4 BANKS ? 16 BIT DDR2 SDRAM
• Manufacturer: WINBOND [Winbond]

11. PACKAGE SPECIFICATION
Package Outline WBGA-84 (8x12.5 mm
SOLDER BALL DIAMETER REFERS.
TO POST REFLOW CONDITION.
84xΦb
9
eE
8
7
SYMBOL
aaa
bbb
ccc
A1
D1
E1
eE
eD
D
A
b
E
E1
THE WINDOW-SIDE
ENCAPSULANT
12.40
MIN.
3
0.25
0.40
7.90
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---
---
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DIMENSION (MM)
2
11.20 BSC.
6.40 BSC.
0.80 BSC.
0.80 BSC.
1
12.50
NOM.
8.00
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---
---
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PIN A1 INDEX
A
B
C
D
E
F
G
H
J
K
L
N
P
R
M
12.60
A1
MAX.
0.15
0.20
0.10
1.20
0.40
0.50
8.10
SEATING PLANE
C
2
A
)
- 86 -
ccc
//
C
PIN A1 INDEX
bbb
C
A
Note: 1. Ball land : 0.5mm
Publication Release Date: Dec. 09, 2011
2. Ball opening : 0.4mm
3. PCB Ball land suggested ≤ 0.4mm
Ball Opening
Ball Land
E
W9751G6KB
Revision A01
B
aaa
C
4X