STM32F103C4H6ATR STMICROELECTRONICS [STMicroelectronics], STM32F103C4H6ATR Datasheet - Page 74
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STM32F103C4H6ATR
Manufacturer Part Number
STM32F103C4H6ATR
Description
Low-density performance line, ARM-based 32-bit MCU with 16 or 32 KB Flash, USB, CAN, 6 timers, 2 ADCs, 6 communication interfaces
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
1.STM32F103C4H6ATR.pdf
(80 pages)
- Current page: 74 of 80
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6.2
6.2.1
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Thermal characteristics
The maximum chip junction temperature (T
Table 9: General operating conditions on page
The maximum chip-junction temperature, T
using the following equation:
Where:
●
●
●
●
P
taking into account the actual V
application.
Table 54.
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
Symbol
I/O
JA
max represents the maximum power dissipation on output pins where:
T
P
P
internal power.
P
A
D
INT
I/O
JA
max is the maximum ambient temperature in C,
max is the sum of P
is the package junction-to-ambient thermal resistance, in C/W,
max = (V
Thermal resistance junction-ambient
TFBGA64 - 5 × 5 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP48 - 7 × 7 mm / 0.5 mm pitch
Thermal resistance junction-ambient
VFQFPN 36 - 6 × 6 mm / 0.5 mm pitch
max is the product of I
Package thermal characteristics
OL
× I
OL
T
INT
) + ((V
J
Doc ID 15060 Rev 3
max = T
OL
max and P
DD
Parameter
/ I
and V
DD
OL
A
– V
and V
max + (P
DD
OH
I/O
J
J
, expressed in Watts. This is the maximum chip
max) must never exceed the values given in
max, in degrees Celsius, may be calculated
) × I
OH
max (P
30.
/ I
OH
D
OH
),
max ×
D
of the I/Os at low and high level in the
max = P
JA
)
INT
max + P
Value
65
45
55
18
I/O
max),
°C/W
Unit
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