MCF5270 FREESCALE [Freescale Semiconductor, Inc], MCF5270 Datasheet - Page 33

• Manufacturer Part Number: MCF5270
• Description: 32-bit Embedded Controller Division
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

8.2
Table 27
Freescale Semiconductor
NOTES:
1
2
3
4
5
6
Junction to ambient, natural convection
Junction to ambient (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
Maximum operating junction temperature
θ
Motorola recommends the use of θ
device junction temperatures from exceeding the rated specification. System designers should be aware that
device junction temperatures can be significantly influenced by board layout and surrounding devices.
Conformance to the device junction temperature specification can be verified by physical measurement in the
customer’s system using the Ψ
EIA/JESD Standard 51-2.
Per JEDEC JESD51-6 with the board horizontal.
θ
Motorola recommends the use of θ
device junction temperatures from exceeding the rated specification. System designers should be aware that
device junction temperatures can be significantly influenced by board layout and surrounding devices.
Conformance to the device junction temperature specification can be verified by physical measurement in the
customer’s system using the Ψ
EIA/JESD Standard 51-2.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8.
Board temperature is measured on the top surface of the board near the package.
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8.
Board temperature is measured on the top surface of the board near the package.
lists thermal resistance values
Thermal Characteristics
JMA
JMA
2
3
4
5
and Ψ
and Ψ
This device contains circuitry protecting against damage due to high static voltage or
electrical fields; however, it is advised that normal precautions be taken to avoid application of
any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of
operation is enhanced if unused inputs are tied to an appropriate logic voltage level (e.g.,
either V
Input must be current limited to the value specified. To determine the value of the required
current-limiting resistor, calculate resistance values for positive and negative clamp voltages,
then use the larger of the two values.
All functional non-supply pins are internally clamped to V
Power supply must maintain regulation within operating OV
and operating maximum current conditions. If positive injection current (V
than I
going out of regulation. Insure external OV
injection current. This will be the greatest risk when the processor is not consuming power
(ex; no clock).Power supply must maintain regulation within operating OV
instantaneous and operating maximum current conditions.
jt
jt
parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection.
parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection.
DD
SS
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 1.2
, the injection current may flow out of OV
or OV
DD
Characteristic
).
jt
jt
parameter, the device power dissipation, and the method described in
parameter, the device power dissipation, and the method described in
Table 27. Thermal Characteristics
JmA
JmA
and power dissipation specifications in the system design to prevent
and power dissipation specifications in the system design to prevent
Four layer board (2s2p)
Four layer board (2s2p)
DD
load will shunt current greater than maximum
DD
and could result in external power supply
SS
DD
and OV
Symbol
range during instantaneous
θ
θ
θ
θ
Ψ
JMA
JMA
T
JC
JB
jt
j
DD
Preliminary Electrical Characteristics
.
MAPBGA
in
DD
32
29
> OV
196
2
104
20
10
5,9
range during
1,2
5,6
5
7
DD
) is greater
160QFP
40
36
2
105
25
10
5,10
3,4
5,6
6
8
°C / W
°C / W
°C / W
°C / W
°C / W
Unit
o
C
33