TE28F008xxx Intel Corporation, TE28F008xxx Datasheet - Page 9

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TE28F008xxx

Manufacturer Part Number
TE28F008xxx
Description
(TE28F Series) 3 Volt Advanced Boot Block Flash Memory
Manufacturer
Intel Corporation
Datasheet
2.0
2.1
3UHOLPLQDU\
Figure 1. 40-Lead TSOP Package for x8 Configurations
Product Description
This section explains device pin description and package pinouts.
Package Pinouts
The 3 Volt Advanced Boot Block flash memory is available in 40-lead TSOP (x8,
48-lead TSOP (x16,
and 48-ball VF BGA (x16,
upgrades have been circled.
NOTES:
1. 40-Lead TSOP available for 8- and 16-Mbit densities only.
2. Lower densities will have NC on the upper address pins. For example, an 8-Mbit device will have NC on
Pin 38.
4 M
A
A
A
A
A
A
A
A
WE#
RP#
V
WP#
A
A
A
A
A
A
A
A
16
15
14
13
12
11
9
8
PP
18
7
6
5
4
3
2
1
28F004/400B3, 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
Figure
Figure
2) and 48-ball BGA(x8 and x16,
10
11
12
13
14
15
16
17
18
19
20
1
2
3
4
5
6
7
8
9
4) packages. In all figures, pin changes necessary for density
Advanced Boot Block
10 mm x 20 mm
40-Lead TSOP
TOP VIEW
Figure 3
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
and
Figure
A
GND
A
A
A
DQ
DQ
DQ
DQ
V
V
NC
DQ
DQ
DQ
DQ
OE#
GND
CE#
A
17
20
19
10
CCQ
CC
0
7
6
5
4
3
2
1
0
Figure
4, respectively)
16 M
8 M
1),
0580_01
3

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