K7D801871B-HC30 Samsung semiconductor, K7D801871B-HC30 Datasheet - Page 16

• Manufacturer Part Number: K7D801871B-HC30
• Description: 256Kx36 & 512Kx18 SRAM
• Manufacturer: Samsung semiconductor

K7D803671B
K7D801871B
153 BGA PACKAGE THERMAL CHARACTERISTICS
NOTE : 1. Junction temperature can be calculated by : T
153 BGA PACKAGE DIMENSIONS
Junction to Ambient(at still air)
Junction to Case
Junction to Board
TOP VIEW
12.50
0.492
0.551
14.00
0.004
0.10
0.004
0.10
Parameter
J
= T
A
+ P
Theta_JA
Theta_JC
Theta_JB
D
0.024
Symbol
0.60
x Theta_JA.
0.006
0.15 MAX
0.022
0.035
0.087
0.56
0.90
2.21
- 16
0.10
0.004
0.04
MAX
0.002
0.10
0.004
NOTE :
1. All Dimensions are in Millimeters.
2. Solder Ball to PCS Offset : 0.10 MAX.
3. PCB to Cavity Offset : 0.10 MAX.
Thermal Resistance
0.3/0.012MAX
30.0
256Kx36 & 512Kx18 SRAM
5.9
4.8
9 8
BOTTOM VIEW
7 6 5 4 3 2 1
0.050
1.27
Unit
C/W
C/W
C/W
153-
1W Heating
2W Heating
January. 2002
0.030
Note
0.75
Rev 4.0
0.15
0.006