AM41LV3204MB10IT AMD [Advanced Micro Devices], AM41LV3204MB10IT Datasheet - Page 65
![no-image](/images/no-image-200.jpg)
AM41LV3204MB10IT
Manufacturer Part Number
AM41LV3204MB10IT
Description
Stacked Multi-chip Package (MCP) 32 Mbit (4 M x 8 bit/2 M x 16-bit) Flash Memory and 4 Mbit (512K x 8-Bit/256 K x 16-Bit) Static RAM
Manufacturer
AMD [Advanced Micro Devices]
Datasheet
1.AM41LV3204MB10IT.pdf
(67 pages)
- Current page: 65 of 67
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TLB069—69-Ball Fine-pitch Ball Grid Array (FBGA) 8 x 10 mm Package
64
A
PACKAGE
SYMBOL
JEDEC
SD/SE
CORNER
MD
ME
D1
Ob
eD
A1
A2
E1
eE
0.15
D
(2X)
A
E
n
PIN A1
A2
A1
C
69X
J1,J2,J9,J10,K2,K3,K4,K7,K8,K9
10.00 mm X 8.00 mm PACKAGE
A2,A3,A4,A7,A8,A9,B2,B9,B10
C1,C10,D1,D10,E5,E6,F5,F6
MIN.
0.20
0.81
0.33
---
0.15
0.08
INDEX MARK
6
G1,G10,H1,H10
b
M
M C
10
10.00 BSC
8.00 BSC
7.20 BSC
7.20 BSC
0.80 BSC
0.80 BSC
0.40 BSC
TLB 069
NOM.
C
N/A
10
10
69
---
---
---
---
A B
SIDE VIEW
TOP VIEW
D
MAX.
1.20
0.97
0.43
---
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
NOTE
P R E L I M I N A R Y
Am41LV3204M
C
A
0.15
(2X)
E
B
C
0.20 C
0.08
eE
C
NOTES:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10. A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER
10
eD
9
8
7
6
5
4
3
2
1
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
e REPRESENTS THE SOLDER BALL GRID PITCH.
SYMBOL "MD" IS THE BALL MATRIX IN THE "D" DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX IN THE "E" DIRECTION.
n IS THE NUMBER OF POPULATED SOLDER BALL
POSITIONS FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO
DATUMS A AND B AND DEFINE THE POSITION OF THE
CENTER SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS
IN THE OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS
IN THE OUTER ROW, SD OR SE = E/2
"+" INDICATES THE THEORETICAL CENTER OF
DEPOPULATED BALLS.
NOT USED.
OR INK MARK, METALLIZED MARK INDENTATION OR
OTHER MEANS.
K
J
SD
H
BOTTOM VIEW
7
G
F
D1
E
D C
B
A
June 10, 2003
SE
CORNER
PIN A1
w052903-163814C
7
E1
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