MAX1267BEEG Maxim Integrated, MAX1267BEEG Datasheet - Page 2

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MAX1267BEEG

Manufacturer Part Number
MAX1267BEEG
Description
Analog to Digital Converters - ADC
Manufacturer
Maxim Integrated
Datasheet

Specifications of MAX1267BEEG

Number Of Channels
2/1
Architecture
SAR
Conversion Rate
265 KSPs
Resolution
12 bit
Input Type
Single-Ended/Pseudo-Differential
Snr
Yes
Interface Type
Parallel
Operating Supply Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
QSOP-24
Maximum Power Dissipation
762 mW
Minimum Operating Temperature
- 40 C
Number Of Converters
1
Voltage Reference
Internal 2.5 V or External
ABSOLUTE MAXIMUM RATINGS
V
CH0–CH5, COM to GND ............................-0.3V to (V
REF, REFADJ to GND.................................-0.3V to (V
Digital Inputs to GND ...............................................-0.3V to +6V
Digital Outputs (D0–D11, INT) to GND.......-0.3V to (V
Continuous Power Dissipation (T
265ksps, +3V, 6-/2-Channel, 12-Bit ADCs
with +2.5V Reference and Parallel Interface
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
T
2
DC ACCURACY (Note 1)
DYNAMIC SPECIFICATIONS (f
CONVERSION RATE
DD
Resolution
Relative Accuracy (Note 2)
Differential Nonlinearity
Offset Error
Gain Error
Gain Temperature Coefficient
Channel-to-Channel Offset
Matching
Signal-to-Noise Plus Distortion
Total Harmonic Distortion
(Including 5th-Order Harmonic)
Spurious-Free Dynamic Range
Intermodulation Distortion
Channel-to-Channel Crosstalk
Full-Linear Bandwidth
Full-Power Bandwidth
Conversion Time (Note 5)
Track/Hold Acquisition Time
Aperture Delay
Aperture Jitter
External Clock Frequency
Duty Cycle
A
DD
24-Pin QSOP (derate 9.5mW/°C above +70°C)..........762mW
= T
_______________________________________________________________________________________
to GND ..............................................................-0.3V to +6V
= +2.7V to +3.6V, COM = GND, REFADJ = V
MIN
PARAMETER
to T
MAX
, unless otherwise noted. Typical values are at T
A
IN(sine-wave)
= +70°C)
SYMBOL
SINAD
t
SFDR
CONV
t
RES
DNL
THD
f
IMD
ACQ
INL
CLK
= 50kHz, V
MAX126_A
MAX126_B
No missing codes overtemperature
(Note 3)
f
f
SINAD > 68dB
-3dB rolloff
External clock mode
External acquisition/internal clock mode
Internal acquisition/internal clock mode
External acquisition or external clock mode
External acquisition or external clock mode
Internal acquisition/internal clock mode
IN1
IN
= 125kHz (Note 4)
= 49kHz, f
DD
DD
DD
DD
, V
+ 0.3V)
+ 0.3V)
+ 0.3V)
IN
REF
= 2.5V
= +2.5V, 4.7µF capacitor at REF pin, f
IN2
CONDITIONS
= 52kHz
P-P
A
= +25°C.)
, 265ksps, external f
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Operating Temperature Ranges
28-Pin QSOP (derate 8.0mW/°C above +70°C)..........667mW
MAX1265_C_ _ /MAX1267_C_ _ ........................0°C to +70°C
MAX1265_E_ _ /MAX1267_E_ _ ......................-40°C to +85°C
CLK
= 4.8MHz, bipolar input mode)
MIN
3.3
2.5
3.2
0.1
12
67
80
30
CLK
= 4.8MHz (50% duty cycle),
<200
±2.0
±0.2
TYP
<50
250
-78
3.0
3.6
70
76
50
3
MAX
±0.5
625
-78
3.5
4.1
4.8
±1
±1
±4
±4
70
ppm/°C
UNITS
MHz
MHz
LSB
LSB
LSB
LSB
LSB
Bits
kHz
dB
dB
dB
dB
dB
µs
ns
ns
ps
%

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