MK20DN512VLL10 Freescale Semiconductor, MK20DN512VLL10 Datasheet - Page 2

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MK20DN512VLL10

Manufacturer Part Number
MK20DN512VLL10
Description
ARM Microcontrollers - MCU Kinetis 512K
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MK20DN512VLL10

Rohs
yes
Core
ARM Cortex M4
Processor Series
MK20DN512
Data Bus Width
32 bit
Maximum Clock Frequency
100 MHz
Program Memory Size
512 KB
Data Ram Size
128 KB
On-chip Adc
Yes
Operating Supply Voltage
1.71 V to 3.6 V
Operating Temperature Range
- 40 C to + 105 C
Package / Case
LQFP-100
Mounting Style
SMD/SMT
A/d Bit Size
16 bit
A/d Channels Available
2
Interface Type
CAN, I2C, I2S, SPI, UART, USB
Maximum Operating Temperature
+ 105 C
Minimum Operating Temperature
- 40 C
Number Of Timers
2
On-chip Dac
Yes
Program Memory Type
Flash
Supply Voltage - Max
3.6 V
Supply Voltage - Min
1.71 V

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MK20DN512VLL10
Manufacturer:
FREESCALE
Quantity:
450
Part Number:
MK20DN512VLL10
0
1 Ordering parts...........................................................................4
2 Part identification......................................................................4
3 Terminology and guidelines......................................................5
4 Ratings......................................................................................10
5 General.....................................................................................11
2
1.1 Determining valid orderable parts......................................4
2.1 Description.........................................................................4
2.2 Format...............................................................................4
2.3 Fields.................................................................................4
2.4 Example............................................................................5
3.1 Definition: Operating requirement......................................5
3.2 Definition: Operating behavior...........................................6
3.3 Definition: Attribute............................................................6
3.4 Definition: Rating...............................................................7
3.5 Result of exceeding a rating..............................................7
3.6 Relationship between ratings and operating
3.7 Guidelines for ratings and operating requirements............8
3.8 Definition: Typical value.....................................................8
3.9 Typical value conditions....................................................9
4.1 Thermal handling ratings...................................................10
4.2 Moisture handling ratings..................................................10
4.3 ESD handling ratings.........................................................10
4.4 Voltage and current operating ratings...............................10
5.1 AC electrical characteristics..............................................11
5.2 Nonswitching electrical specifications...............................11
5.3 Switching specifications.....................................................19
5.4 Thermal specifications.......................................................21
requirements......................................................................7
5.2.1
5.2.2
5.2.3
5.2.4
5.2.5
5.2.6
5.2.7
5.2.8
5.3.1
5.3.2
5.4.1
5.4.2
Voltage and current operating requirements......12
LVD and POR operating requirements...............12
Voltage and current operating behaviors............13
Power mode transition operating behaviors.......14
Power consumption operating behaviors............15
EMC radiated emissions operating behaviors....18
Designing with radiated emissions in mind.........19
Capacitance attributes........................................19
Device clock specifications.................................19
General switching specifications.........................20
Thermal operating requirements.........................21
Thermal attributes...............................................21
K20 Sub-Family Data Sheet, Rev. 2, 12/2012.
Table of Contents
6 Peripheral operating requirements and behaviors....................22
7 Dimensions...............................................................................66
8 Pinout........................................................................................66
6.1 Core modules....................................................................22
6.2 System modules................................................................26
6.3 Clock modules...................................................................26
6.4 Memories and memory interfaces.....................................31
6.5 Security and integrity modules..........................................37
6.6 Analog...............................................................................37
6.7 Timers................................................................................52
6.8 Communication interfaces.................................................52
6.9 Human-machine interfaces (HMI)......................................65
7.1 Obtaining package dimensions.........................................66
8.1 K20 Signal Multiplexing and Pin Assignments..................66
8.2 K20 Pinouts.......................................................................70
6.1.1
6.1.2
6.3.1
6.3.2
6.3.3
6.4.1
6.4.2
6.4.3
6.6.1
6.6.2
6.6.3
6.6.4
6.8.1
6.8.2
6.8.3
6.8.4
6.8.5
6.8.6
6.8.7
6.8.8
6.8.9
6.8.10
6.9.1
Debug trace timing specifications.......................22
JTAG electricals..................................................23
MCG specifications.............................................26
Oscillator electrical specifications.......................28
32 kHz Oscillator Electrical Characteristics........30
Flash electrical specifications.............................31
EzPort Switching Specifications.........................33
Flexbus Switching Specifications........................34
ADC electrical specifications..............................37
CMP and 6-bit DAC electrical specifications......45
12-bit DAC electrical characteristics...................48
Voltage reference electrical specifications..........51
USB electrical specifications...............................52
USB DCD electrical specifications......................53
USB VREG electrical specifications...................53
CAN switching specifications..............................54
DSPI switching specifications (limited voltage
range).................................................................54
DSPI switching specifications (full voltage
range).................................................................55
I2C switching specifications................................57
UART switching specifications............................57
SDHC specifications...........................................57
I2S/SAI Switching Specifications........................58
TSI electrical specifications................................65
Freescale Semiconductor, Inc.

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