CY7C1380D-167AXC Cypress Semiconductor Corp, CY7C1380D-167AXC Datasheet - Page 16
![IC SRAM 18MBIT 167MHZ 100LQFP](/photos/6/76/67624/428-100-tqfp_14x20x1_4_sml.jpg)
CY7C1380D-167AXC
Manufacturer Part Number
CY7C1380D-167AXC
Description
IC SRAM 18MBIT 167MHZ 100LQFP
Manufacturer
Cypress Semiconductor Corp
Type
Synchronousr
Datasheet
1.CY7C1380D-167AXC.pdf
(34 pages)
Specifications of CY7C1380D-167AXC
Memory Size
18M (512K x 36)
Package / Case
100-LQFP
Format - Memory
RAM
Memory Type
SRAM - Synchronous
Speed
167MHz
Interface
Parallel
Voltage - Supply
3.135 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Access Time
3.4 ns
Maximum Clock Frequency
167 MHz
Supply Voltage (max)
3.6 V
Supply Voltage (min)
3.135 V
Maximum Operating Current
275 mA
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Mounting Style
SMD/SMT
Number Of Ports
4
Operating Supply Voltage
3.3 V
Density
18Mb
Access Time (max)
3.4ns
Sync/async
Synchronous
Architecture
SDR
Clock Freq (max)
167MHz
Operating Supply Voltage (typ)
3.3V
Address Bus
19b
Package Type
TQFP
Operating Temp Range
0C to 70C
Supply Current
275mA
Operating Supply Voltage (min)
3.135V
Operating Supply Voltage (max)
3.6V
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
100
Word Size
36b
Number Of Words
512K
Memory Configuration
1M X 18 / 512K X 36
Clock Frequency
167MHz
Supply Voltage Range
3.135V To 3.6V
Memory Case Style
TQFP
No. Of Pins
100
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
428-1629
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CY7C1380D-167AXC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Part Number:
CY7C1380D-167AXC
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
20 000
Company:
Part Number:
CY7C1380D-167AXCT
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Identification Register Definitions
Scan Register Sizes
Identification Codes
Note
Document #: 38-05543 Rev. *F
Revision Number (31:29)
Device Depth (28:24)
Device Width (23:18) 119-BGA
Device Width (23:18) 165-FBGA
Cypress Device ID (17:12)
Cypress JEDEC ID Code (11:1)
ID Register Presence Indicator (0)
Instruction
Bypass
ID
Boundary Scan Order (119-ball BGA package)
Boundary Scan Order (165-ball FBGA package)
EXTEST
IDCODE
SAMPLE Z
RESERVED
SAMPLE/PRELOAD
RESERVED
RESERVED
BYPASS
13. Bit #24 is 1 in the register definitions for both 2.5v and 3.3v versions of this device.
Instruction
Instruction Field
Register Name
[13]
Code
000
001
010
100
101
011
110
111
Captures I/O ring contents. Places the boundary scan register between TDI and TDO.
Forces all SRAM outputs to High-Z state.
Loads the ID register with the vendor ID code and places the register between TDI and TDO.
This operation does not affect SRAM operations.
Captures I/O ring contents. Places the boundary scan register between TDI and TDO.
Forces all SRAM output drivers to a High-Z state.
Do Not Use. This instruction is reserved for future use.
Captures I/O ring contents. Places the boundary scan register between TDI and TDO.
Does not affect SRAM operation.
Do Not Use. This instruction is reserved for future use.
Do Not Use. This instruction is reserved for future use.
Places the bypass register between TDI and TDO. This operation does not affect SRAM
operations.
CY7C1380D/CY7C1380F
00000110100
(512K x 36)
101000
000000
100101
01011
000
1
CY7C1382D/CY7C1382F
Bit Size (x36)
00000110100
(1 Mbit x 18)
32
85
89
3
1
101000
000000
010101
Description
01011
000
1
CY7C1380D, CY7C1382D
Defines the width and density.
Indicates the presence of an ID
CY7C1380F, CY7C1382F
Describes the version number.
Reserved for internal use.
Defines the memory type and
architecture.
Defines the memory type and
architecture.
Allows unique identification of
SRAM vendor.
register.
Bit Size (x18)
Description
32
85
89
3
1
Page 16 of 34
[+] Feedback