HYB25D512800CE-6 Qimonda, HYB25D512800CE-6 Datasheet - Page 22

IC DDR SDRAM 512MBIT 66TSOP

HYB25D512800CE-6

Manufacturer Part Number
HYB25D512800CE-6
Description
IC DDR SDRAM 512MBIT 66TSOP
Manufacturer
Qimonda
Datasheet

Specifications of HYB25D512800CE-6

Format - Memory
RAM
Memory Type
DDR SDRAM
Memory Size
512M (64M x 8)
Speed
166MHz
Interface
Parallel
Voltage - Supply
2.3 V ~ 2.7 V
Operating Temperature
0°C ~ 70°C
Package / Case
66-TSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
675-1008-2

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HYB25D512800CE-6
Manufacturer:
QIMONDA
Quantity:
20 000
1)
2) Deselect or NOP commands should be issued on any clock edges occurring during the Self Refresh Exit (
1. CKEn is the logic state of CKE at clock edge n: CKE n-1 was the state of CKE at the previous clock edge.
2. Current state is the state of the DDR SDRAM immediately prior to clock edge n.
3. COMMAND n is the command registered at clock edge n, and ACTION n is a result of COMMAND n.
4. All states and sequences not shown are illegal or reserved.
Rev. 1.41, 2007-12
03292006-3TFJ-HNV3
Current State
Self Refresh
Self Refresh
Power Down
Power Down
All Banks Idle
All Banks Idle
Bank(s) Active
V
clock cycles are needed before applying a read command to allow the DLL to lock to the input clock.
REF
must be maintained during Self Refresh operation
CKE n-1
Previous
Cycle
L
L
L
L
H
H
H
H
CKEn
Current
Cycle
L
H
L
H
L
L
L
H
Command n
X
Deselect or NOP
X
Deselect or NOP
Deselect or NOP
AUTO REFRESH
Deselect or NOP
See
Table 16
Date: 2007-12-13
22
Action n
Active Power-Down Entry
Maintain Self-Refresh
Exit Self-Refresh
Maintain Power-Down
Exit Power-Down
Precharge Power-Down Entry
Self Refresh Entry
HY[B/I]25D512[40/80/16]0C[C/E/F/T](L)
Truth Table 3: Clock Enable (CKE)
512-Mbit Double-Data-Rate SDRAM
t
XSNR
) period. A minimum of 200
Internet Data Sheet
TABLE 15
Notes
1)
2)

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