MT48H4M16LFB4-8 IT Micron Technology Inc, MT48H4M16LFB4-8 IT Datasheet - Page 54

• Manufacturer Part Number: MT48H4M16LFB4-8 IT
• Description: IC SDRAM 64MBIT 125MHZ 54VFBGA
• Manufacturer: Micron Technology Inc

Specifications of MT48H4M16LFB4-8 IT

• Format - Memory: RAM
• Memory Type: Mobile SDRAM
• Memory Size: 64M (4M x 16)
• Speed: 125MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.9 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 54-VFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NOTE:
Data Sheet Designation
maximum limits specified over the complete power
supply and temperature range for production devices.
Although considered final, these specifications are
subject to change, as further product development and
data characterization sometimes occur.
pdf: 09005aef80a63953, source: 09005aef808a7edc
Y25L_64Mb_2.fm - Rev. E 11/04 EN
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-REFLOW
DIAMETER IS 0.42.
1. All dimensions are in millimeters.
E-mail: [e-mail], Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
Production: This data sheet contains minimum and
SEATING PLANE
54X Ø0.45 ±0.05
6.40
3.20 ±0.05
0.10 C
BALL A9
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
0.65 ±0.05
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc.
C
3.20 ±0.05
All other trademarks are the property of their respective owners.
Figure 50: 54-Ball FBGA (8mm x 8mm)
8.00 ±0.10
6.40
C L
0.80
TYP
4.00 ±0.05
0.80 TYP
C L
BALL A1
BALL A1 ID
4.00 ±0.05
54
8.00 ±0.10
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2% Ag
SOLDER MASK DEFINED BALL PADS: Ø0.40
SUBSTRATE MATERIAL: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
MOBILE SDRAM
©2003 Micron Technology, Inc. All rights reserved.
BALL A1 ID
64Mb: x16