MT18VDVF12872DG-40BF1 Micron Technology Inc, MT18VDVF12872DG-40BF1 Datasheet - Page 31
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MT18VDVF12872DG-40BF1
Manufacturer Part Number
MT18VDVF12872DG-40BF1
Description
MODULE DDR 1GB 184-DIMM VLP
Manufacturer
Micron Technology Inc
Specifications of MT18VDVF12872DG-40BF1
Memory Type
DDR SDRAM
Memory Size
1GB
Speed
400MT/s
Package / Case
184-DIMM
Main Category
DRAM Module
Sub-category
DDR SDRAM
Module Type
184VLPRDIMM
Device Core Size
72b
Organization
128Mx72
Total Density
1GByte
Chip Density
512Mb
Maximum Clock Rate
400MHz
Operating Supply Voltage (typ)
2.6V
Operating Current
1.8A
Number Of Elements
18
Operating Supply Voltage (max)
2.7V
Operating Supply Voltage (min)
2.5V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Pin Count
184
Mounting
Socket
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Temperature and Air Flow Specifications
Figure 11:
PDF: 09005aef81c73825/Source: 09005aef81c73837
DVF18C64_128x72D_2.fm - Rev. A 8/05 EN
100
90
80
70
60
50
40
30
20
Component Case Temperature vs. Air Flow
Notes: 1. Micron Technology, Inc. recommends a minimum air flow of 1 meter/second (~197 LFM)
2. The component case temperature measurements shown above were obtained experimen-
3. Temperature versus air speed data is obtained by performing experiments with the system
4. The memory diagnostic software used for determining worst-case component tempera-
across all modules.
tally. The typical system to be used for experimental purposes is a dual-processor 600 MHz
work station, fully loaded, with four comparable registered memory modules. Case tem-
peratures charted represent worst-case component locations on modules installed in the
internal slots of the system.
motherboard removed from its case and mounted in a Eiffel-type low air speed wind tun-
nel. Peripheral devices installed on the system motherboard for testing are the proces-
sor(s) and video card, all other peripheral devices are mounted outside of the wind tunnel
test chamber.
tures is a memory diagnostic software application developed for internal use by Micron
Technology, Inc.
T
T
max
ave
- memory stress software
- memory stress software
T
ave
Air Flow (meters/sec)
- 3D gaming software
512MB, 1GB: (x72, DR) 184-Pin DDR VLP RDIMM
31
Temperature and Air Flow Specifications
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Ambient Temperature = 25º C
Minimum Air Flow
©2003, 2004, 2005 Micron Technology, Inc. All rights reserved.