MAX15034BEVKIT+ Maxim Integrated Products, MAX15034BEVKIT+ Datasheet - Page 24

• Manufacturer Part Number: MAX15034BEVKIT+
• Description: KIT EVALUATION FOR MAX15034
• Manufacturer: Maxim Integrated Products

Specifications of MAX15034BEVKIT+

• Main Purpose: DC/DC, Step Down
• Voltage - Input: 5 ~ 28V
• Regulator Topology: Buck
• Board Type: Fully Populated
• Utilized Ic / Part: MAX15034
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output: -
• Voltage - Output: -
• Power - Output: -
• Frequency - Switching: -
• Outputs And Type: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

In practical applications, pick the crossover frequency
(f
First calculate R
so that:
where C
Calculate C
where C
The MAX15034 can be used to regulate two outputs
from one controller. Each of the two outputs can be
turned on and off independently of one another by con-
trolling the enable input of each phase (EN1 and EN2).
A logic-low on each enable pin shuts down the
MOSFET drivers for that phase. When the voltage on the
enable pin exceeds 1.2V, the drivers are turned on and
the output can come up to regulation. This method of
turning on the outputs allows the MAX15034 to be used
for power sequencing.
Careful PCB layout is critical to achieve low losses, low
output noise, and clean and stable operation. This is
Configurable, Single-/Dual-Output, Synchronous
Buck Controller for High-Current Applications
24
C
) in the range of:
______________________________________________________________________________________
CF
CFF
is C10 and C12 in Figure 6.
Independent Turn-On and Turn-Off
CFF
is C11 and C13 in Figure 6.
C
so that:
Applications Information
CFF
CF
C
CF
in equation 2 above. Calculate C
=
f
SW
10
2
=
× ×
2 π
<
π
× ×
PCB Layout Guidelines
f
C
f
C
<
10
f
C
1
×
f
SW
2
10
×
R
×
CF
R
CF
CF
especially true for dual-phase converters where one
channel can affect the other. Use the following guide-
lines for PCB layout:
1) Place the V
2) Minimize all high-current switching loops.
3) Keep the power traces and load connections short.
4) Run the current-sense lines CSP_ and CSN_ very
5) Place the bank of output capacitors close to the
6) Isolate the power components on the top side from
7) Provide enough copper area around the switching
8) Distribute the power components evenly across the
9) Keep AGND and PGND isolated and connect them
10) Place all input bypass capacitors for each input as
capacitors close to the MAX15034.
This practice is essential for high efficiency. Use
thick copper PCBs (2oz or higher) to enhance effi-
ciency and minimize trace inductance and resis-
tance.
close to each other to minimize loop areas. Do not
cross these critical signal lines through power cir-
cuitry. Sense the current right at the pads of the
current-sense resistors.
load.
the analog components on the bottom side with a
ground plane in between.
MOSFETs, inductors, and sense resistors to aid in
thermal dissipation and reducing resistance.
top side for proper heat dissipation.
at one single point close to the IC. Do not connect
them together anywhere else.
close to each other as is practical.
DD
, REG, and the BST1 and BST2 bypass