CYII5SC1300-EVAL Cypress Semiconductor Corp, CYII5SC1300-EVAL Datasheet - Page 38

• Manufacturer Part Number: CYII5SC1300-EVAL
• Description: BOARD EVAL IMG SENS IBIS5-B-1300
• Manufacturer: Cypress Semiconductor Corp

Specifications of CYII5SC1300-EVAL

• Sensor Type: CMOS Imaging, Color (RGB)
• Sensing Range: 1.3 Megapixel
• Interface: Parallel/Serial
• Sensitivity: 106 fps
• Voltage - Supply: 3 V ~ 4.5 V
• Embedded: No
• Utilized Ic / Part: IBIS5-B-1300
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Contains lead / RoHS non-compliant

Document #: 38-05710 Rev. *A
Storage and Handling
Storage Conditions
Table 29.Storage Conditions
Handling and Soldering Conditions
Special care must be taken when soldering image sensors
with color filter arrays (RGB color filters) onto a circuit board
since color filters are sensitive to high temperatures.
Prolonged heating at elevated temperatures may result in
deterioration of the performance of the sensor. The following
recommendations are made to ensure that sensor perfor-
mance is not compromised during end-users' assembly
processes.
Board Assembly
Device placement onto boards must be done in accordance
with strict ESD controls for Class 0, JESD22 Human Body
Model, and Class A, JESD22 Machine Model devices.
Assembly operators must always wear all designated and
approved grounding equipment; grounded wrist straps at ESD
protected workstations are recommended including the use of
ionized blowers. All tools must be ESD protected.
Manual Soldering
When a soldering iron is used the following conditions must be
observed:
Use a soldering iron with temperature control at the tip. The
soldering iron tip temperature must not exceed 350°C.
The soldering period for each pin must be less than 5 seconds.
Reflow Soldering
Figure 42
for a reflow soldering system. If the temperature/time profile
Temperature
Description
shows the maximum recommended thermal profile
Minimum
–30
Figure 42. Reflow Soldering Temperature Profile
Maximum
+85
Units
°C
exceeds these recommendations damage to the image sensor
may occur. See
Precautions and Cleaning
Avoid spilling solder flux on the cover glass; bare glass and
particularly glass with antireflection filters may be adversely
affected by the flux. Avoid mechanical or particulate damage
to the cover glass.
It is recommended that isopropyl alcohol (IPA) be used as a
solvent for cleaning the image sensor glass lid. When using
other solvents, it must be confirmed beforehand whether or not
the solvent will dissolve the package and/or the glass lid.
RoHS (lead-free) Compliance
This paragraph reports the use of Hazardous chemical
substances as required by the RoHS Directive (excluding
packing material).
Table 30.The Chemical Substances and Information about
Any Intentional Content
Lead
Cadmium
Mercury
Hexavalent
chromium
PBB (Polybromi-
nated biphenyls)
PBDE (Polybro-
minated diphenyl
ethers)
Substance
Chemical
Figure 42
intentional
content?
Any
NO
NO
NO
NO
NO
NO
for more details.
CYII5FM1300AB
content, in which portion
If there is any intentional
IBIS5-B-1300
is it contained?
-
-
-
-
-
-
Page 38 of 42
[+] Feedback