MPC8572DS Freescale Semiconductor, MPC8572DS Datasheet - Page 99
MPC8572DS
Manufacturer Part Number
MPC8572DS
Description
KIT MPU POWERQUICC III
Manufacturer
Freescale Semiconductor
Series
PowerQUICC III™r
Type
MPUr
Specifications of MPC8572DS
Contents
Board
Data Rate
10 Mbps to 100 Mbps
Memory Type
Flash, DDR, DDR2, DDR3, SDRAM
Interface Type
I2C, Ethernet
Operating Voltage
3.3 V
Data Bus Width
32 bit
Product
Development Tools
Silicon Manufacturer
Freescale
Core Architecture
Power Architecture
Core Sub-architecture
PowerQUICC
Silicon Core Number
MPC85xx
Silicon Family Name
PowerQUICC III
Rohs Compliant
Yes
For Use With/related Products
MPC8572E
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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18 Package Description
This section describes package parameters, pin assignments, and dimensions.
18.1
The package parameters are as provided in the following list. The package type is 33 mm × 33 mm, 1023
flip chip plastic ball grid array (FC-PBGA).
Freescale Semiconductor
Package outline
Interconnects
Ball Pitch
Ball Diameter (Typical)
Solder Balls
Solder Balls (Lead-Free)
Package Parameters for the MPC8572E FC-PBGA
MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
1023
1 mm
0.6 mm
63% Sn
37% Pb
96.5% Sn
33 mm × 33 mm
3.5% Ag
Package Description
99
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