PIC16C770/P Microchip Technology, PIC16C770/P Datasheet - Page 204

• Manufacturer Part Number: PIC16C770/P
• Description: IC MCU CMOS A/D 2K 20MHZ 20-DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C770/P

• Program Memory Type: OTP
• Program Memory Size: 3.5KB (2K x 14)
• Package / Case: 20-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 15
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 6x12b
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C
• Processor Series: PIC16C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: I2C/SPI/SSP
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 16
• Number Of Timers: 3
• Operating Supply Voltage: 2.5 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000
• Minimum Operating Temperature: 0 C
• On-chip Adc: 6-ch x 12-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DVA16XP200 - ADAPTER ICE 20DIP/SOIC/SSOPAC164028 - MODULE SKT PROMATEII 20SOIC/DIP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC16C717/770/771
17.5
DS41120B-page 202
20-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-019
n
eB
E1
E
Dimension Limits
§
2
1
D
c
Units
A2
eB
A1
E1
B1
E
D
B
n
p
A
L
c
A1
A
MIN
1.025
.140
.115
.015
.295
.240
.120
.008
.055
.014
.310
5
5
B
INCHES*
B1
NOM
1.033
.100
.155
.130
.310
.250
.130
.012
.060
.018
.370
20
10
10
MAX
1.040
.170
.145
.325
.260
.140
.015
.065
.022
.430
15
15
MIN
26.04
3.56
2.92
0.38
7.49
6.10
3.05
0.20
1.40
0.36
7.87
5
5
MILLIMETERS
p
NOM
2002 Microchip Technology Inc.
26.24
6.35
2.54
3.94
3.30
7.87
3.30
0.29
1.52
0.46
9.40
A2
20
10
10
L
MAX
26.42
10.92
4.32
3.68
8.26
6.60
3.56
0.38
1.65
0.56
15
15