MC9S08GT60ACFBE Freescale Semiconductor, MC9S08GT60ACFBE Datasheet - Page 274

• Manufacturer Part Number: MC9S08GT60ACFBE
• Description: IC MCU 60K FLASH 4K RAM 44-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08GT60ACFBE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 36
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-QFP
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 40MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 4KB
• # I/os (max): 36
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8/2.08V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 44
• Package Type: PQFP
• Processor Series: S08GT
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 4 KB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 39
• Number Of Timers: 2
• Operating Supply Voltage: 0 V to 1.8 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: M68EVB908GB60E, M68DEMO908GB60E
• Minimum Operating Temperature: - 40 C
• For Use With: M68DEMO908GB60E - BOARD DEMO MC9S08GB60M68EVB908GB60E - BOARD EVAL FOR MC9S08GB60
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

Appendix A Electrical Characteristics
A.8.1
274
Oscillator crystal or resonator
Input clock frequency (CLKS = 11, REFS = 0)
Input clock frequency (CLKS = 10, REFS = 0)
Internal reference frequency (untrimmed)
Duty cycle of input clock
Output clock ICGOUT frequency
Minimum DCO clock (ICGDCLK) frequency
Maximum DCO clock (ICGDCLK) frequency
Self-clock mode (ICGOUT) frequency
Self-clock mode reset (ICGOUT) frequency
Loss of reference frequency
Loss of DCO frequency
Crystal start-up time
FLL lock time
FLL frequency unlock range
FLL frequency lock range
ICGOUT period jitter,
Internal oscillator deviation from trimmed frequency
(Fundamental mode crystal or ceramic resonator)
Low range
High range
Low range
High range
CLKS = 10, REFS = 0
All other cases
Low range
High range
Low range
High range
Low range
High range
Long term jitter (averaged over 2 ms interval)
V
V
High Gain, FBE (HGO=1,CLKS = 10)
High Gain, FEE (HGO=1,CLKS = 11)
Low Power, FBE (HGO=0, CLKS=10)
Low Power, FEE (HGO=0, CLKS=11)
DD
DD
= 1.8 – 3.6 V, (constant temperature)
= 3.0 V ±10%, –40° C to 85° C
ICG Frequency Specifications
4, 6
(V
DDA
Characteristic
4, 5
4, 7
= V
4
3
measured at f
DDA
(REFS = 0)
2
4
(min) to V
(REFS = 1)
Table A-9. ICG Frequency Specifications
1
ICGOUT
DDA
MC9S08GB60A Data Sheet, Rev. 2
Max
(max), Temperature Range = –40 to 85°C Ambient)
8
f
f
ICGDCLKmax
ICGDCLKmin
f
f
Symbol
ICGIRCLK
f
fhi_eng
flp_eng
Self_reset
fhi_byp
flp_byp
n
ACC
ICGOUT
f
t
t
C
t
n
hi_eng
t
f
CSTH
f
f
CSTL
Lockh
Unlock
f
Lockl
Extal
LOR
LOD
flo
t
Self
Lock
Jitter
f
dc
lo
int
f
f
ICGDCLKmin
Extal
f
182.25
lo
–4*N
–2*N
Min
5.5
0.5
32
32
40
(min)
50
—
—
—
—
—
—
—
1
2
1
2
2
0
8
5
(min)
Typical
± 0.5
±0.5
243
430
—
—
—
—
—
—
—
—
—
—
—
8
4
Freescale Semiconductor
f
f
f
ICGDCLKmax
ICGDCLKmax
Extal
303.75
(max)
Max
10.5
100
100
500
4*N
2*N
1.5
0.2
16
10
10
10
10
40
60
40
25
±2
±2
—
—
2
2
(max)
counts
counts
% f
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
Unit
kHz
kHz
kHz
kHz
ms
ms
%
%
ICG