MC9S08GT60ACFBE Freescale Semiconductor, MC9S08GT60ACFBE Datasheet - Page 50

• Manufacturer Part Number: MC9S08GT60ACFBE
• Description: IC MCU 60K FLASH 4K RAM 44-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08GT60ACFBE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 36
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-QFP
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 40MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 4KB
• # I/os (max): 36
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8/2.08V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 44
• Package Type: PQFP
• Processor Series: S08GT
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 4 KB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 39
• Number Of Timers: 2
• Operating Supply Voltage: 0 V to 1.8 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: M68EVB908GB60E, M68DEMO908GB60E
• Minimum Operating Temperature: - 40 C
• For Use With: M68DEMO908GB60E - BOARD DEMO MC9S08GB60M68EVB908GB60E - BOARD EVAL FOR MC9S08GB60
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

1
0xFFB0 –
0xFFB7
0xFFB8 –
0xFFBC
0xFFBD
0xFFBE
0xFFBF
Chapter 4 Memory
Provided the key enable (KEYEN) bit is 1, the 8-byte comparison key can be used to temporarily
disengage memory security. This key mechanism can be accessed only through user code running in secure
memory. (A security key cannot be entered directly through background debug commands.) This security
key can be disabled completely by programming the KEYEN bit to 0. If the security key is disabled, the
only way to disengage security is by mass erasing the flash if needed (normally through the background
debug interface) and verifying that flash is blank. To avoid returning to secure mode after the next reset,
program the security bits (SEC01:SEC00) to the unsecured state (1:0).
4.3
The MC9S08GBxxA/GTxxA includes static RAM. The locations in RAM below 0x0100 can be accessed
using the more efficient direct addressing mode, and any single bit in this area can be accessed with the bit
manipulation instructions (BCLR, BSET, BRCLR, and BRSET). Locating the most frequently accessed
program variables in this area of RAM is preferred.
The RAM retains data when the MCU is in low-power wait, stop2, or stop3 mode. At power-on or after
wakeup from stop1, the contents of RAM are uninitialized. RAM data is unaffected by any reset provided
that the supply voltage does not drop below the minimum value for RAM retention.
For compatibility with older M68HC05 MCUs, the HCS08 resets the stack pointer to 0x00FF. In the
MC9S08GBxxA/GTxxA, it is usually best to re-initialize the stack pointer to the top of the RAM so the
direct page RAM can be used for frequently accessed RAM variables and bit-addressable program
variables. Include the following 2-instruction sequence in your reset initialization routine (where RamLast
is equated to the highest address of the RAM in the Freescale-provided equate file).
When security is enabled, the RAM is considered a secure memory resource and is not accessible through
BDM or through code executing from non-secure memory. See
description of the security feature.
4.4
The flash memory is intended primarily for program storage. In-circuit programming allows the operating
program to be loaded into the flash memory after final assembly of the application product. It is possible
50
Address
This location is used to store the factory trim value for the ICG.
NVBACKKEY
Reserved
NVPROT
Reserved
NVOPT
RAM
Flash
Register Name
LDHX
TXS
1
#RamLast+1
FPOPEN
KEYEN
Bit 7
—
—
—
Table 4-4. Nonvolatile Register Summary
FNORED
FPDIS
MC9S08GB60A Data Sheet, Rev. 2
—
—
—
6
;point one past RAM
;SP<-(H:X-1)
FPS2
—
—
—
5
0
8-Byte Comparison Key
FPS1
—
—
—
4
0
Section 4.5,
FPS0
—
—
—
3
0
“Security”
—
—
—
2
0
0
Freescale Semiconductor
SEC01
for a detailed
—
—
—
1
0
SEC00
Bit 0
—
—
—
0