MC9S08GT60ACFBE Freescale Semiconductor, MC9S08GT60ACFBE Datasheet - Page 276

• Manufacturer Part Number: MC9S08GT60ACFBE
• Description: IC MCU 60K FLASH 4K RAM 44-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08GT60ACFBE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 36
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-QFP
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 40MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 4KB
• # I/os (max): 36
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8/2.08V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 44
• Package Type: PQFP
• Processor Series: S08GT
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 4 KB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 39
• Number Of Timers: 2
• Operating Supply Voltage: 0 V to 1.8 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: M68EVB908GB60E, M68DEMO908GB60E
• Minimum Operating Temperature: - 40 C
• For Use With: M68DEMO908GB60E - BOARD DEMO MC9S08GB60M68EVB908GB60E - BOARD EVAL FOR MC9S08GB60
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

Appendix A Electrical Characteristics
A.9.1
1
2
3
4
276
Bus frequency (t
Real-time interrupt internal oscillator period
External reset pulse width
Reset low drive
Active background debug mode latch setup time
Active background debug mode latch hold time
IRQ pulse width
Port rise and fall time (load = 50 pF)
This is the shortest pulse that is guaranteed to be recognized as a reset pin request. Shorter pulses are not guaranteed to
override reset requests from internal sources.
When any reset is initiated, internal circuitry drives the reset pin low for about 34 cycles of f
on the reset pin about 38 cycles later to distinguish external reset requests from internal requests.
This is the minimum pulse width that is guaranteed to pass through the pin synchronization circuitry. Shorter pulses may or
may not be recognized. In stop mode, the synchronizer is bypassed so shorter pulses can be recognized in that case.
Timing is shown with respect to 20% V
Slew rate control disabled
Slew rate control enabled
Control Timing
2
3
cyc
= 1/f
RESET PIN
Bus
Parameter
1
Figure A-12. Active Background Debug Mode Latch Timing
)
BKGD/MS
4
RESET
DD
and 80% V
MC9S08GB60A Data Sheet, Rev. 2
Table A-10. Control Timing
Figure A-11. Reset Timing
t
MSSU
DD
levels. Temperature range –40°C to 85°C.
t
Symbol
Rise
t
t
t
MSSU
t
rstdrv
t
f
extrst
t
MSH
t
ILIH
Bus
RTI
extrst
, t
Fall
f
f
1.5 x t
Self_reset
Self_reset
1.5 x
34 x
Min
700
dc
25
25
—
—
cyc
t
MSH
Self_reset
Typical
30
—
3
and then samples the level
Freescale Semiconductor
1300
Max
20
—
—
—
—
—
MHz
Unit
μs
ns
ns
ns
ns
ns
ns