MC9S08GT60ACFBE Freescale Semiconductor, MC9S08GT60ACFBE Datasheet - Page 60

• Manufacturer Part Number: MC9S08GT60ACFBE
• Description: IC MCU 60K FLASH 4K RAM 44-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08GT60ACFBE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 36
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-QFP
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 40MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 4KB
• # I/os (max): 36
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8/2.08V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 44
• Package Type: PQFP
• Processor Series: S08GT
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 4 KB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 39
• Number Of Timers: 2
• Operating Supply Voltage: 0 V to 1.8 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: M68EVB908GB60E, M68DEMO908GB60E
• Minimum Operating Temperature: - 40 C
• For Use With: M68DEMO908GB60E - BOARD DEMO MC9S08GB60M68EVB908GB60E - BOARD EVAL FOR MC9S08GB60
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

1
Chapter 4 Memory
4.6.3
Bits 7 through 5 may be read or written at any time. Bits 4 through 0 always read 0 and cannot be written.
4.6.4
During reset, the contents of the nonvolatile location NVPROT is copied from flash into FPROT. Bits 0,
1, and 2 are not used and each always reads as 0. This register may be read at any time, but user program
writes have no meaning or effect. Background debug commands can write to FPROT.
60
Background commands can be used to change the contents of these bits in FPROT.
FPOPEN
KEYACC
Reset
Reset
Field
Field
5
7
W
W
R
R
FPOPEN
Flash Configuration Register (FCNFG)
Flash Protection Register (FPROT and NVPROT)
Enable Writing of Access Key — This bit enables writing of the backdoor comparison key. For more detailed
information about the backdoor key mechanism, refer to
0 Writes to 0xFFB0–0xFFB7 are interpreted as the start of a flash programming or erase command.
1 Writes to NVBACKKEY (0xFFB0–0xFFB7) are interpreted as comparison key writes.
Open Unprotected Flash for Program/Erase
0 Entire flash memory is block protected (no program or erase allowed).
1 Any flash location, not otherwise block protected or secured, may be erased or programmed.
(1)
0
0
7
7
Reads of the flash return invalid data.
= Unimplemented or Reserved
= Unimplemented or Reserved
FPDIS
(1)
0
0
6
6
This register is loaded from nonvolatile location NVPROT during reset.
Figure 4-6. Flash Configuration Register (FCNFG)
Figure 4-7. Flash Protection Register (FPROT)
Table 4-10. FPROT Field Descriptions
Table 4-9. FCNFG Field Descriptions
KEYACC
FPS2
MC9S08GB60A Data Sheet, Rev. 2
(1)
0
5
5
FPS1
(1)
0
0
4
4
Description
Description
Section 4.5,
FPS0
(1)
3
0
0
3
“Security.”
0
0
0
2
2
Freescale Semiconductor
0
0
0
1
1
0
0
0
0
0