MC9S08GT60ACFBE Freescale Semiconductor, MC9S08GT60ACFBE Datasheet - Page 35

IC MCU 60K FLASH 4K RAM 44-QFP

MC9S08GT60ACFBE

Manufacturer Part Number
MC9S08GT60ACFBE
Description
IC MCU 60K FLASH 4K RAM 44-QFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08GT60ACFBE

Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
36
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-QFP
Cpu Family
HCS08
Device Core Size
8b
Frequency (max)
40MHz
Interface Type
I2C/SCI/SPI
Total Internal Ram Size
4KB
# I/os (max)
36
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
1.8/2.08V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
44
Package Type
PQFP
Processor Series
S08GT
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
4 KB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
39
Number Of Timers
2
Operating Supply Voltage
0 V to 1.8 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
M68EVB908GB60E, M68DEMO908GB60E
Minimum Operating Temperature
- 40 C
For Use With
M68DEMO908GB60E - BOARD DEMO MC9S08GB60M68EVB908GB60E - BOARD EVAL FOR MC9S08GB60
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant

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Chapter 3
Modes of Operation
3.1
The operating modes of the MC9S08GBxxA/GTxxA are described in this section. Entry into each mode,
exit from each mode, and functionality while in each of the modes are described.
3.2
3.3
This is the normal operating mode for the MC9S08GBxxA/GTxxA. This mode is selected when the
BKGD/MS pin is high at the rising edge of reset. In this mode, the CPU executes code from internal
memory with execution beginning at the address fetched from memory at 0xFFFE:0xFFFF after reset.
3.4
The active background mode functions are managed through the background debug controller (BDC) in
the HCS08 core. The BDC, together with the on-chip debug module (DBG), provide the means for
analyzing MCU operation during software development.
Active background mode is entered in any of five ways:
Freescale Semiconductor
Active background mode for code development
Wait mode:
— CPU shuts down to conserve power
— System clocks running
— Full voltage regulation maintained
Stop modes:
— System clocks stopped; voltage regulator in standby
— Stop1 — Full power down of internal circuits for maximum power savings
— Stop2 — Partial power down of internal circuits, RAM contents retained
— Stop3 — All internal circuits powered for fast recovery
When the BKGD/MS pin is low at the rising edge of reset
When a BACKGROUND command is received through the BKGD pin
When a BGND instruction is executed
When encountering a BDC breakpoint
Introduction
Features
Run Mode
Active Background Mode
MC9S08GB60A Data Sheet, Rev. 2
35

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