EM250-BBRD-R Ember, EM250-BBRD-R Datasheet - Page 112

• Manufacturer Part Number: EM250-BBRD-R
• Description: EM250 BREAKOUT BOARD
• Manufacturer: Ember
• Type: Transceiver, 802.15.4r

Specifications of EM250-BBRD-R

• Frequency: 2.4GHz
• For Use With/related Products: EM250
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 636-1024

EM250
9 QFN48 Footprint Recommendations
120-0082-000S
Figure 20. Paste Mask Dimensions
Figure 19 demonstrates the IPC-7351 recommended PCB Footprint for the EM250 (QFN50P700X700X90-49N). A
ground pad in the bottom center of the package forms a 49
A 3 x 3 array of non-thermal vias should connect the EM250 decal center shown in Figure 19 to the PCB ground
plane through the ground pad. In order to properly solder the EM250 to the footprint, the Paste Mask layer
should have a 3 x 3 array of circular openings at 1.015mm diameter spaced approximately 1.625mm (center to
center) apart, as shown in Figure 20. This will cause an evenly distributed solder flow and coplanar attach-
ment to the PCB. The solder mask layer (illustrated in Figure 21) should be the same as the copper layer for
the EM250 footprint.
For more information on the package footprint, please refer to the EM250 Reference Design.
C2
b0
b2
a2
a0
b1
Figure 19. PCB Footprint for the EM250
a1
X2
C1
Page 112
X1
th
Figure 21. Solder Mask Dimensions
pin.
E
Y1
Via Drill DIA = 0.254mm
Y2
C1
C2
X1
X2
Y1
Y2
a0
a1
a2
b0
b1
b2
E
* Dimensions in mm
MIN
TYP
1.80
1.80
6.85
6.85
0.30
5.40
0.90
5.40
0.50
1.625
0.725
1.625
0.725
MAX