MC68EC060RC66 Freescale Semiconductor, MC68EC060RC66 Datasheet - Page 22

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MC68EC060RC66

Manufacturer Part Number
MC68EC060RC66
Description
IC MPU 32BIT 66MHZ 206-PGA
Manufacturer
Freescale Semiconductor
Datasheets

Specifications of MC68EC060RC66

Processor Type
M680x0 32-Bit
Speed
66MHz
Voltage
3.3V
Mounting Type
Surface Mount
Package / Case
206-PGA
Family Name
M68000
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
66MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
3.3V
Operating Supply Voltage (max)
3.465V
Operating Supply Voltage (min)
3.135V
Operating Temp Range
0C to 110C
Operating Temperature Classification
Commercial
Mounting
Through Hole
Pin Count
206
Package Type
PGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Lead Free Status / Rohs Status
Compliant
7-7
7-8
7-9
7-10
8-1
8-2
8-3
9-1
9-2
9-3
9-4
9-5
10-1
10-2
10-3
10-4
10-5
10-6
10-7
10-8
10-9
10-10
10-11
10-12
10-13
10-14
10-15
10-16
10-17
10-18
10-19
10-20
10-21
10-22
10-23
10-24
10-25
10-26
11-1
11-2
11-3
11-4
C-1
C-2
C-3
xxiv
List of Tables
MC68040-Arbitration Protocol State Description ............................................. 7-56
MC68060-Arbitration Protocol State Transition Conditions.............................. 7-62
MC68060-Arbitration Protocol State Description ............................................. 7-63
Special Mode vs. IPLx Signals......................................................................... 7-74
Exception Vector Assignments .......................................................................... 8-4
Interrupt Levels and Mask Values.................................................................... 8-12
Exception Priority Groups ................................................................................ 8-17
JTAG States....................................................................................................... 9-2
JTAG Instructions............................................................................................... 9-4
Boundary Scan Bit Definitions.......................................................................... 9-10
Debug Command Interface Pins ...................................................................... 9-25
Command Summary ........................................................................................ 9-28
Superscalar OEP Dispatch Test Algorithm ...................................................... 10-4
MC68060 Superscalar Classification of M680x0 Integer Instructions.............. 10-4
Superscalar Classification of M680x0 Privileged Instructions.......................... 10-7
Superscalar Classification of M680x0 Floating-Point Instructions ................... 10-7
Effective Address Calculation Times.............................................................. 10-14
Move Byte and Word Execution Times .......................................................... 10-15
Move Long Execution Times.......................................................................... 10-15
MOVE16 Execution Times ............................................................................. 10-15
Standard Instruction Execution Time ............................................................. 10-16
Immediate Instruction Execution Times ......................................................... 10-17
Single-Operand Instruction Execution Times................................................. 10-18
Clear (CLR) Execution Times ........................................................................ 10-18
Shift/Rotate Execution Times......................................................................... 10-19
Bit Manipulation (Dynamic Bit Count) Execution Times................................. 10-19
Bit Manipulation (Static Bit Count) Execution Times...................................... 10-20
Bit Field Execution Times............................................................................... 10-20
Branch Execution Times ................................................................................ 10-21
JMP, JSR Execution Times............................................................................ 10-21
Return Instruction Execution Times ............................................................... 10-21
LEA, PEA, and MOVEM Instruction Execution Times ................................... 10-22
Multiprecision Instruction Execution Times .................................................... 10-22
Status Register (SR) Instruction Execution Times ......................................... 10-23
MOVES Execution Times............................................................................... 10-23
Miscellaneous Instruction Execution Times ................................................... 10-23
Floating-Point Instruction Execution Times.................................................... 10-24
Exception Processing Times.......................................................................... 10-26
With Heat Sink, No Air Flow........................................................................... 11-18
With Heat Sink, with Air Flow ......................................................................... 11-18
No Heat Sink .................................................................................................. 11-19
Support Devices and Products....................................................................... 11-20
Call-Out Dispatch Table and Module Size .........................................................C-4
FPU Comparison..............................................................................................C-12
Unimplemented Instructions.............................................................................C-13
M68060 USER’S MANUAL
MOTOROLA

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