TDA5230XT Infineon Technologies, TDA5230XT Datasheet - Page 168

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TDA5230XT

Manufacturer Part Number
TDA5230XT
Description
Manufacturer
Infineon Technologies
Datasheet

Specifications of TDA5230XT

Operating Temperature (min)
-40C
Operating Temperature (max)
105C
Operating Temperature Classification
Industrial
Product Depth (mm)
4.4mm
Product Length (mm)
9.7mm
Lead Free Status / Rohs Status
Compliant
RF Characteristics
Data Sheet
B.5
B.6
B.7
B.8
B.9
B.10 Brownout threshold
B.11 Receiver startup time
B.12 Channel Hop Latency Time
B.13 RF-Frontend startup delay
B.14 Interrupt duration
B 15 P_ON minimal pulse width
B 16
C.1
#
Supply current in Power Down
Mode
T
T
T
Supply current in Power Down
Mode
T
T
T
Supply current of IF buffer-
amplifier
Supply current of clock
generation unit
Receiver reset time
and
Configuration Change Latency
Time (Configuration A to B)
Minimal T
TDA5230
RF-PLL
Operational frequency band 1
Operational frequency band 2
amb
amb
amb
amb
amb
amb
= 25 °C
= 85 °C
= 105 °C
= 25 °C
= 85 °C
= 105 °C
Parameter
MasterPeriod
I
I
I
I
t
V
t
t
t
t
t
T
f
f
VDDpdwn
VDDpdwn
buff
VDDclock
Reset
RXstartup
CHHOP
RFstartdelay
INT
P_ON
band1
band2
MasterPeriod
BOR
Symbol
0,8
119
12
72
1
100
5
433
865
164
min.
Limit Values
0.6
3
6
0.8
2.5
5
0.5
20
2,45
Note 1 119
Note 1 12
Note 1 72
Note 1
Note 3
Note 4
typ.
1.5
12
25
1.5
10
20
0.7
25
5
1
450
870
max.
µA
µA
µA
µA
µA
µA
mA
µA
ms
V
64*T
Note 2
64*T
64*T
64*T
µs
ms
MHz
MHz
Unit
Version 4.0, 2007-06-01
sys
sys
sys
sys
VDD5V = VDDA =
VDDD = 3.6 V
VDD5V = 5.5 V
P
f
C
Time to startup
RF-Frontend
(comprises time
required to switch
crystal oscillator
from low power to
high precision
mode)
Time to switch
RF-PLL between
different RF-
Channels. (does
not include settling
of the data clock
recovery.)
Delay of startup of
RF-Frontend
Pulse width of
interrupt
Minimum pulse
width to reset the
chip
Minimal
Masterperiod for
stable operation
Lo-Side
LO Injection
CLKOUT
Test Conditions
in
Load
Specifications
< -50 dBm
=10 pF
=1 kHz
TDA523x
*
*
*
*
*
*

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