TDA5230XT Infineon Technologies, TDA5230XT Datasheet - Page 50

• Manufacturer Part Number: TDA5230XT
• Manufacturer: Infineon Technologies

Specifications of TDA5230XT

• Operating Temperature (min): -40C
• Operating Temperature (max): 105C
• Operating Temperature Classification: Industrial
• Product Depth (mm): 4.4mm
• Product Length (mm): 9.7mm
• Lead Free Status / Rohs Status: Compliant

2.4.5.8
The chip enters Run Mode Self Polling after a successful fulfillment of a wake up
criterion in Self Polling Mode.
The following steps are performed automatically, depending on register settings
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Depending on the interrupt masking, the host micro controller is alerted when
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See also
Run Mode Self Polling is left, when synchronization is lost and the Time Out Timer
(TOTIM) has elapsed, and when the mode is switched to SLEEP or Run Mode Slave by
the host microcontroller.
As long as the chip is in Run Mode Self Polling, incoming data frames, even without
additional wake up patterns, can be received and stored.
The data FIFO can be either initialized and cleared at
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Further information about the data FIFO is found in the
Data Sheet
Modulation switching (see
Wait for valid TSI (see
Initialize FIFO (see
Scan for MID’s (see
a data frame has started,
an MID has been found, (if enabled) or
EOM (End of Message) has been detected.
Cycle Start, that means whenever Run Mode Self Polling is entered or
Frame Start, when a TSI has been successfully identified.
Chapter 2.4.17 Interrupt Generation Unit
Run Mode Self Polling
Chapter 2.4.15 Data
Chapter 2.4.14 Message-ID
Chapter 2.4.13 Frame
Chapter 2.4.5.6 Automatic Modulation
46
FIFO) and write data to FIFO
Synchronization)
Scanning)
Chapter 2.4.15 Data
Functional Description
Version 4.0, 2007-06-01
Switching)
TDA523x
FIFO.