AT90PWM216 Atmel Corporation, AT90PWM216 Datasheet - Page 277

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AT90PWM216

Manufacturer Part Number
AT90PWM216
Description
Manufacturer
Atmel Corporation
Datasheets

Specifications of AT90PWM216

Flash (kbytes)
16 Kbytes
Pin Count
24
Max. Operating Frequency
16 MHz
Cpu
8-bit AVR
# Of Touch Channels
12
Hardware Qtouch Acquisition
No
Max I/o Pins
19
Ext Interrupts
4
Usb Speed
No
Usb Interface
No
Spi
1
Uart
1
Graphic Lcd
No
Video Decoder
No
Camera Interface
No
Adc Channels
8
Adc Resolution (bits)
10
Adc Speed (ksps)
125
Analog Comparators
2
Resistive Touch Screen
No
Dac Channels
1
Dac Resolution (bits)
10
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
1
Eeprom (bytes)
512
Self Program Memory
YES
Dram Memory
No
Nand Interface
No
Picopower
No
Temp. Range (deg C)
-40 to 105
I/o Supply Class
2.7 to 5.5
Operating Voltage (vcc)
2.7 to 5.5
Fpu
No
Mpu / Mmu
no / no
Timers
4
Output Compare Channels
12
Input Capture Channels
1
Pwm Channels
7
32khz Rtc
No
Calibrated Rc Oscillator
Yes
24.7.10
24.7.11
24.7.12
7710F–AVR–09/11
Preventing Flash Corruption
Programming Time for Flash when Using SPM
Simple Assembly Code Example for a Boot Loader
the value of the Fuse High byte (FHB) will be loaded in the destination register as shown below.
Refer to
When reading the Extended Fuse byte, load 0x0002 in the Z-pointer. When an LPM instruction
is executed within three cycles after the BLBSET and SPMEN bits are set in the SPMCSR, the
value of the Extended Fuse byte (EFB) will be loaded in the destination register as shown below.
Refer to
byte.
Fuse and Lock bits that are programmed, will be read as zero. Fuse and Lock bits that are
unprogrammed, will be read as one.
During periods of low V
too low for the CPU and the Flash to operate properly. These issues are the same as for board
level systems using the Flash, and the same design solutions should be applied.
A Flash program corruption can be caused by two situations when the voltage is too low. First, a
regular write sequence to the Flash requires a minimum voltage to operate correctly. Secondly,
the CPU itself can execute instructions incorrectly, if the supply voltage for executing instructions
is too low.
Flash corruption can easily be avoided by following these design recommendations (one is
sufficient):
The calibrated RC Oscillator is used to time Flash accesses.
gramming time for Flash accesses from the CPU.
Table 24-5.
Bit
Rd
Bit
Rd
Flash write (Page Erase, Page Write, and
write Lock bits by SPM)
1. If there is no need for a Boot Loader update in the system, program the Boot Loader
2. Keep the AVR RESET active (low) during periods of insufficient power supply voltage.
3. Keep the AVR core in Power-down sleep mode during periods of low V
Lock bits to prevent any Boot Loader software updates.
This can be done by enabling the internal Brown-out Detector (BOD) if the operating
voltage matches the detection level. If not, an external low V
can be used. If a reset occurs while a write operation is in progress, the write operation
will be completed provided that the power supply voltage is sufficient.
vent the CPU from attempting to decode and execute instructions, effectively protecting
the SPMCSR Register and thus the Flash from unintentional writes.
;-the routine writes one page of data from RAM to Flash
; the first data location in RAM is pointed to by the Y pointer
Table 25-5 on page 284
Table 25-4 on page 282
SPM Programming Time
FHB7
Symbol
7
7
CC
FHB6
, the Flash program can be corrupted because the supply voltage is
6
6
for detailed description and mapping of the Fuse High byte.
FHB5
for detailed description and mapping of the Extended Fuse
5
5
Min Programming Time
FHB4
4
4
3.7 ms
FHB3
EFB3
3
3
AT90PWM216/316
FHB2
EFB2
Table 24-5
2
2
CC
reset protection circuit
Max Programming Time
FHB1
EFB1
1
1
shows the typical pro-
CC
. This will pre-
4.5 ms
FHB0
EFB0
0
0
277

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