MCIMX285AJM4A Freescale Semiconductor, MCIMX285AJM4A Datasheet

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... Li-Ion batteries. The i.MX28 processor includes an additional 128-Kbyte on-chip SRAM to make the device ideal for eliminating external RAM in applications with small footprint RTOS. © 2012 Freescale Semiconductor, Inc. All rights reserved. Document Number: IMX28AEC Rev. 3, 07/2012 i.MX28 Package Information Plastic package Case MAPBGA-289 mm, 0 ...

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... Five application Universal Asynchronous Receiver-Transmitters (UARTs 3.25 Mbps with hardware flow control • One debug UART operating 115 Kb/s using programmed I/O 2 • Two I C master/slave interfaces 400 kbps • Four 32-bit timers and a rotary decoder i.MX28 Applications Processors for Automotive Products, Rev Freescale Semiconductor ...

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... MCIMX281AVM4B MCIMX285AVM4B Table 2 provides the functional differences between the i.MX281 and i.MX285. Function LCD Interface Touch Screen i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor Table 1. Ordering Information –40 to +85 –40 to +85 Table 2. i.MX28 Functional Differences i.MX281 — — Introduction Package mm, 0 ...

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... Introduction 1.3 Block Diagram Figure 1 shows the simplified interface block diagram. Figure 1. i.MX28 Simplified Interface Block Diagram i.MX28 Applications Processors for Automotive Products, Rev Freescale Semiconductor ...

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... SAIF FlexCAN LCD interface High-speed ADC LRADC (touchscreen, keypad...) Ethernet MAC Universal Serial Bus (USB) i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor Table 3. i.MX28 Functions Yes 8-bit 4 dedicated / 8 with muxing 5 dedicated / 8 with muxing 4 dedicated / 5 with muxing 3 dedicated / 4 with muxing ...

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... This module provides support for general encryption and hashing functions typically used for security functions. Because its basic job is moving data from memory to memory, it also incorporates a memory-copy (memcopy) function for both debugging and as a more efficient method of copying data between memory blocks than the DMA-based approach. Brief Description Freescale Semiconductor ...

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... L2 Network Control Programmable 3-Port Ethernet Switch with QOS Switch i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor Brief Description first-level page table (L1PT) using a hardware-based approach. performance monitors, high-entropy pseudo-random number seed, free-running microseconds counter, and other chip control functions. ...

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... The pixel pipeline (PXP) is used to perform alpha blending of graphic or video buffers with graphics data before sending to an LCD display. The PXP also supports image rotation for hand-held devices that require both portrait and landscape image support. Freescale Semiconductor ...

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... Connectivity USB PHY peripherals i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor Brief Description The real-time clock (RTC) and alarm share a one-second pulse time domain. The watchdog reset and millisecond counter run on a one-millisecond time domain. The RTC, alarm, and persistent bits reside in a special power domain (crystal domain) that remains powered up even when the rest of the chip is in its powered-down state ...

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... Stresses beyond those listed under damage to the device. i.MX28 Applications Processors for Automotive Products, Rev Table 5. The package contact assignment is found in Assignments.” Signal descriptions are provided in the reference Table 5. Signal Considerations Descriptions CAUTION Table 6 may cause permanent Section 4, Freescale Semiconductor ...

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... BGA Package 1 Human Body Model (HBM) 1 Charge Device Model (CDM) 1 HBM and CDM pass ESD testing per AEC-Q100. i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor Table 6. DC Absolute Maximum Ratings Symbol BATT DD5V V DD5V V ...

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... DDD /V DDIO33_EMI DDI 3.0 — 3.6 O18 1.7 — 1.9 /V DDIO_EMIQ 1.7 1.8 1.9 1.425 1.5 1.625 3 BATT 3.10 — 4.242 — 4.75 5.00 5.25 — — — — Min Typ Max –40 — 85 –40 — 105 Table 9 Freescale Semiconductor Unit µA µA Unit ° C ° C may not be ...

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... Run IDD. Power Rail VDDD VDDIO33 VDDA VDDIO_EMI VDDIO18 1 CPUCLK = 300 MHz, AHBCLK = 150 MHz i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor Section 3.2, “Thermal Characteristics.” Table 11. PSWITCH Input Characteristics HW_PWR_STS_PSWITCH 0x00 0x01 0x11 Run IDD Test Case Table 12. ...

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... V DDIO DDA linear regulator provides current to both DDIO linear regulator provides DDA Maximum Output Current Freescale Semiconductor Unit % and DDM ...

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... Table 16. Recommended Operating Conditions—AHB Clock (clk_h) VDDD (V) VDDD Brown-out 1.350 1.250 1.450 1.350 1.550 1.45 1 All timing control bit fields in HW_DIGCTRL_ARMCACHE should be set to the same value. i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor HW_ HW_ AHBCLK HW_ CLKCTRL CLKCTRL / clk_h CLKCTRL FRAC_ CPU_DIV_CP Frequency HBUS_DI ...

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... Table 20. Power Mode Settings Offstate Off Off Off EMICLK Fmax (MHz) DDR2 mDDR 205.71 205.71 196.36 196.36 196.36 196.36 Min Typ Max 21.39 25.05 33.54 — — 4.07 Typ. Max. — 10 24.000 — 32.768/32.0 — Standby Run Off On Off Freescale Semiconductor Unit mA mA Unit MHz MHz kHz ...

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... Two layer Substrate • Substrate solder mask thickness: 0.025 mm • Substrate metal thicknesses: 0.016 mm • Substrate core thickness: 0.160 mm i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor Table 20. Power Mode Settings (continued) Offstate On Off On Off At least 100ms Figure 2. RESETN Timing ...

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... Four layer board (2s2p) Single layer board (1s) Four layer board (2s2p) Natural Convection NOTE Value Unit R 62 °C/W θ °C/W θ °C/W θ JMA R 33 °C/W θ JMA R 24 °C/W θ °C/W θ JCtop Ψ 3 °C/W JT Freescale Semiconductor ...

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... Table 23. ON Impedance of EMI Drivers for Different Drive Strengths Mode 1.5 LVDDR2 1.8 DDR2/mDDR 1 ON impedance of the EMI drivers are guaranteed by design and are not tested during production. i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor Table 22. EMI Digital Pin DC Characteristics Symbol Min. VIH VREF + 0.125 VIL 0.3 VOH ...

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... IOL – Low 3.8 IOL – Medium 7.7 IOL – High 9.0 IOH – Low -9.2 IOH – High -15.2 IOL – Low 7.6 IOL – High 12.0 Pad Voltage 1.8 V 1.8 V 1.5 V Max Unit VDDIO V 0.8 V — V 0.4 V — mA — mA — mA — mA — mA — mA — mA — mA — mA — mA Freescale Semiconductor ...

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... Maximum corner for 1.8 V mode: 1.9 V, -40°C, Fast process. Minimum corner for 1.8 V mode: 1.7 V, 105°C, Slow process. 1 gpio pin (GPMI_D0) and 1 gpio_clk pin (GPMI_WRN) simultaneously loaded. 2 See the i.MX28 reference manual for detailed pull-up configuration of each I/O. i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor Symbol Min Rpu10k 8 Rpu47k ...

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... Testpoint Testpoint Figure 4. Output Pad Transition Waveform Table 27. Base GPIO Test Voltage Test Capacitance — — 1.7~1. 1.7~1. 1.7~1. 3.0~3. 3.0~3. 3.0~3. VDDIO VDDIO Min MaxRise/Fall Unit Rise/Fall — — % 0.82 0.91 1.93 1.97 ns 1.18 1.22 2.69 2.71 2.11 2.03 4.62 4.44 1.04 1.08 2.46 2.18 1.42 1.5 3.29 3 2.46 2.61 5.34 5.12 Freescale Semiconductor Notes — — — — — — — ...

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... Output pad slew rate tps (medium drive) Output pad slew rate tps (low drive) Input pad average tih hysteresis i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor Table 27. Base GPIO (continued) Test Voltage Test Capacitance 1.7~1. 1.7~1. 1.7~1. 3.0~3. ...

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... Unit — — % 0.61 1.29 1.33 ns 0.88 1.94 1.88 1.59 3.88 3.39 0.68 1.47 1.34 1.04 2.11 1.99 2.09 3.97 3.96 0.76 1.68 1.61 ns 1.13 2.63 2.38 2.18 5.61 4.6 0.88 1.84 1.7 1.4 2.76 2.67 3.02 5.59 5.67 1.26 2.88 2.72 ns 1.98 4.84 4.23 4.13 10.95 8.8 1.55 3.05 3 2.62 4.92 5.02 5.96 10.78 11.22 1.87 0.79 0.77 ns 1.30 0.53 0.54 0.72 0.26 0.30 3.18 1.22 1.34 2.08 0.85 0.90 1.03 0.45 0.45 1.50 0.61 0.63 ns 1.01 0.39 0.43 0.52 0.18 0.22 2.45 0.98 1.06 1.54 0.65 0.67 0.72 0.32 0.32 Freescale Semiconductor Notes — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — ...

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... Output pad transition tpr times (maximum drive) Output pad transition tpr times (medium drive) Output pad slew rate tps (maximum drive) i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor Table 28. F-type GPIO (continued) Test Capacitance Min Rise/Fall Max Rise/Fall 1.7~1. 1.44 1.7~1. 0.84 1.7~1. ...

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... Touchscreen Interface — Max Rise/Fall units 1.50 0.61 0.63 ns 1.00 0.39 0.42 0.52 0.18 0.22 2.43 0.98 1.05 1.53 0.65 0.67 0.71 0.32 0.31 100 75 mV 100 50 Min. Typ. Max. — 0.5 — 12 — — 428 1 0 1.85 — 10 — 200 — 50000 Freescale Semiconductor Notes — — — — — — — — Unit pF bits kHz sample cycles V μA Ω ...

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... Maximum sampling rate (fs) Power-up time DC input voltage Current Consumption VDDA DNL fin = 1 kHz INL fin = 1kHz i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor Table 31. HSADC Electrical Specification Conditions AC Electrical Specification — — — DC Electrical Specification — — Electrical Characteristics Min ...

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... Applications Processors for Automotive Products, Rev Table 32. USB PLL Specifications Test Conditions Min — — Table 33. Ethernet PLL Specifications Test Conditions Min — 45 — — — — — — Typ Max Unit — 10 µs Typ Max Unit — 10 µs 25 — ps — +/-20 ppm Freescale Semiconductor ...

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... EMI_ADDR Figure 5. EMI Command/Address AC Timing Table 34. EMI Command/Address AC Timing ID Description DDR1 CK cycle time DDR2 CK high level width DDR3 CK low level width i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor DDR2 DDR5 DDR4 DDR5 bank row column Symbol Min. tCK 4.86 tCH 0.5 tCK – ...

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... Description Min. Max. 0.5 tCK – 1 0.5 tCK + 0.5 0.5 tCK – 1 0.5 tCK + 0.5 DDR12 DDR14 d2 d3 DDR16 Symbol Min Max tDQSS –0.5 0.5 tDSH 0.5 tCK 0.5 tCK –0.5 + 0.5 tDSS 0.5 tCK 0.5 tCK –0.5 + 0.5 tDQSH 0.5 tCK 0.5 tCK –0.5 + 0.5 tDQSL 0.5 tCK 0.5 tCK –0.5 + 0.5 Freescale Semiconductor Unit ns ns Unit ...

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... EMI_DQ ID DDR20 Positive DQS latching edge to associated CK edge DDR21 DQS to DQ input skew DDR22 DQS to DQ input hold time i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor Description DDR20 DDR22 DDR21 d0 d1 Figure 7. DDR2 Input AC Timing Table 36. DDR2 Input AC Timing ...

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... The following subsections describe the timing for MII and RMII modes. i.MX28 Applications Processors for Automotive Products, Rev DDR20 DDR22 DDR21 d0 d1 Figure 8. LPDDR1 Input AC Timing Table 37. DDR2 Input AC Timing Description d2 d3 Symbol Min Max tDQSCK 2 6 tDQSQ 0.25 tCK 0.25 tCK –0.85 –0.5 tQH 0.25 tCK 0.25 tCK +0. Freescale Semiconductor Unit ...

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... The transmitter functions correctly ENET0_TX_CLK maximum frequency of 25 MHz + 1%. There is no minimum frequency requirement. Additionally, the processor clock frequency must exceed twice the ENET0_TX_CLK frequency. i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor Table 38 describes the timing parameters (M1–M4) shown in M3 ...

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... Table 39 describes the timing parameters (M5–M8) shown Table 39. MII Transmit Signal Timing 1 Characteristic Table 40 describes the timing parameter (M9) shown Min. Max. Unit 5 — ns — 35% 65% ENET0_TX_CLK period 35% 65% ENET0_TX_CLK period Min. Max. Unit 1.5 — ENET0_TX_CLK period Freescale Semiconductor ...

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... In RMII mode, ENET_CLK is used as the REF_CLK, which MHz ± 50 ppm continuous reference clock. ENET0_RX_DV is used as the CRS_DV in RMII. Other signals under RMII mode include ENET0_TX_EN, ENET0_TXD[1:0], ENET0_RXD[1:0] and ENET0_RX_ER. i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor Table 41 describes the timing parameters (M10–M15) M14 ...

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... Applications Processors for Automotive Products, Rev Table 42 describes the timing parameters (M16–M21) shown in the M16 M18 M19 M20 M21 Table 42. RMII Signal Timing Characteristic M17 Min. Max. Unit 35% 65% ENET_CLK period 35% 65% ENET_CLK period 3 — ns — — — ns Freescale Semiconductor ...

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... Figure 15. Trace Data Signal Timing Diagram ID Ts Data setup Th Data hold i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor Table 43 describes the timing parameters shown in the Table 43. TRACECLK Signal Timing 1 Characteristic Table 44. Trace Data Signal Timing 1 ...

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... V OL Table 46. Rx Pin Characteristics Symbol Min. 0.8 × Vcc — OFFTXD 0. ONRXD OFFRXD Figure 16. FlexCAN Timing Diagram Typ. Max. Unit 1 — Vcc + 0.3 V 0.8 — V Typ. Max. Unit 1 — Vcc V 0.4 — Freescale Semiconductor ...

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... Figure 17. Timing Diagram for FlexCAN Standby Signal SHDN V DIFF RXD Figure 18. Timing Diagram for FlexCAN Shutdown Signal SHDN RS Figure 19. Timing Diagram for FlexCAN Shutdown-to-Standby Signal i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor V x 0.75 CC Bus Externally Driven 1.1V t SBRXDL t DRXDL ...

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... Figure 21. Address Latch Cycle Timing Diagram i.MX28 Applications Processors for Automotive Products, Rev NF2 NF1 NF3 NF5 NF6 NF7 NF8 NF9 Command NF1 NF4 NF3 NF10 NF11 NF5 NF7 NF6 NF8 NF9 Address Figure 20, Figure 21, Figure 22 NF4 Freescale Semiconductor and ...

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... CEn WE ALE IO[7:0] Figure 22. Write Data Latch Cycle Timing Diagram CLE CEn RE RB IO[7:0] Figure 23. Read Data Latch Cycle Timing Diagram i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor NF1 NF3 NF10 NF11 NF5 NF6 NF8 NF9 Data to NF NF14 NF15 NF13 ...

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... DH*T tDSR N/A tDHR N/A 1 Example Timing for ≈ 100 GPMI Clock MHz Unit T = 10ns Min. Max. 10 — 20 — 10 — 20 — — 20 — 10 — 10 — — 10 — 20 — 10 — 10 — 10 — Freescale Semiconductor ...

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... Data setup for falling edge tHF Data hold for falling edge tSR Data setup for rising edge tHR Data hold for rising edge tDW Data valid window i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor Table 48 T tSF tHF tSR tHR tDW DATA/CTRL Notes: ...

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... Freescale Semiconductor START Unit μs μs μs 2 μs μs μs μs ns μ bus ...

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... Data Outputs Data Outputs Data Outputs Figure 27. Boundary Scan (JTAG) Timing Diagram i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor describes the SJC timing parameters (SJ1–SJ13) indicated in the SJ1 SJ2 VM VIL Figure 26. Test Clock Input Timing Diagram SJ4 Input Data Valid ...

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... Output Data Valid SJ11 SJ10 Output Data Valid SJ13 Figure 29. TRST Timing Diagram Table 50. SJC Timing Parameters VIH SJ9 All Frequencies Unit Min. Max. 100 — 40 — — — 50 — — 50 — — 50 — Freescale Semiconductor ...

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... Clock low time 3a Clock fall time 3b Clock rise time 4a Output delay time 4b Output setup time PWMO = 30 pF i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor All Frequencies Min. — — 100 40 Table 51 lists the PWM timing characteristics Figure 30 ...

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... PWM Source Clock PWM Output i.MX28 Applications Processors for Automotive Products, Rev Figure 31. PWM Timing Minimum 1 0 6.813 24.432 — — — 15. Figure 32. PWM Timing Maximum 32 — — 0.3 0.3 14.93 — 3b Freescale Semiconductor Unit MHz ...

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... SAIF Transmitter Timing Figure 33 shows the timing for SAIF transmitter with internal clock, and parameters (SS1–SS13). SS2 BITCLK LRCLK SDATA0-2 Figure 33. SAIF Transmitter Timing Diagram i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor Minimum 1 24 20.99 21.01 — — — 15.92 SS1 ...

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... Applications Processors for Automotive Products, Rev Table 54. SAIF Transmitter Timing Parameter SS1 SS5 SS4 SS14 SS16 SS17 Figure 34. SAIF Receiver Timing Diagram Min. Max. Unit 81.4 — ns 36.0 — ns — 6.0 ns 36.0 — ns — 6.0 ns — 15.0 ns — 15.0 ns — 6.0 ns — 6.0 ns — 15.0 ns — 15.0 ns — 15.0 ns — 6.0 ns Table 55 describes the timing SS3 SS15 Freescale Semiconductor ...

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... SPDIFOUT output (Load = 30pf) • Skew • Transition Rising • Transition Falling Modulating Tx clock (spdif_clk) period spdif_clk high period spdif_clk low period spdif_clk (Input) i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor Parameter Figure 35. Table 56. SPDIF Timing Symbol — — — spclkp ...

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... SD8 CMD DAT0 DAT1 ...... DAT7 Figure 36. SD/MMC4.3 Timing Symbols TLH t THL t OD SD1 Min Max Unit 0 400 kHz 0 25/50 MHz 0 20/52 MHz 100 400 kHz 7 — — ns — — Freescale Semiconductor ...

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... SD2 SSP Output Delay SSP Input / Card Outputs CMD, DAT (Reference to CLK) SD3 SSP Input Setup Time SD4 SSP Input Hold Time i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor Symbols t ISU Table 58 lists the MMC4.4 timing characteristics. Be aware ...

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... Figure 39. MS Serial Transfer Mode Timing Diagram i.MX28 Applications Processors for Automotive Products, Rev show the timing of the Memory Stick. MS1 80% 50% 20% MS2 MS3 MS5 Figure 38. MS Clock Time Waveforms MS1 MS6 MS8 MS10 Table 59 and Table 60 list the 80% 50% 20% MS7 MS9 Freescale Semiconductor ...

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... Table 60. MS Parallel Transfer Timing Parameters ID Parameter MS1 SCK Cycle Time MS2 SCK High Pulse Time MS3 SCK Low Pulse Time MS4 SCK Rise Time i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor MS1 MS11 MS13 MS15 Symbol tCLKc tCLKwh tCLKwl tCLKr tCLKf tBSsu ...

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... Table 61 lists the timing CS5 CS6 CS4 Min. Max. Unit 50 — — ns — 7 — — — — — — — ns Freescale Semiconductor ...

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... UART receive timing, showing only eight data bits and one stop bit. describes the timing parameter (UA2) shown in the figure. – UA2 Start RXD Bit 0 Bit 1 Bit (input) i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor UA1 Bit 2 Bit 3 Bit 4 Bit 5 Figure 42. UART Transmit Timing Diagram Symbol Min 1/F – ...

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... Parallelism measurement excludes any effect of mark on top surface of package. i.MX28 Applications Processors for Automotive Products, Rev Table 63. UART Receive Timing Parameters Symbol 1 t 1/F Rbit ) tolerance in each bit. But accumulation tolerance in one frame must not baud_rate 44: Min. Max. 2 – 1/(16 1/F + 1/(16 baud_rate baud_rate × F × baud_rate baud_rate Freescale Semiconductor Unit — ...

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... Table 64. MAPBGA Power and Ground Contact Assignments Contact Name VDDA1 C13 VDDD G12,G11,F10,F11,K12,F12,G10 VDDIO18 G8,F9,F8,G9 VDDIO33 H8,J8,N3,G3,E6,J9,J10,A7,E16 VDDIO33_EMI N17 VDDIO_EMI P11,R13,N13,N15,G17,M12,M10,G13,M11,L13,G15 i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor Package Information and Contact Assignments Figure 44. i.MX28 Production Package zzxz Contact Assignment 59 ...

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... ENET0_MDIO H4 ENET0_RXD0 H1 ENET0_RXD1 H2 ENET0_RXD2 J1 ENET0_RXD3 J2 ENET0_RX_CLK F3 ENET0_RX_EN E4 ENET0_TXD0 F1 ENET0_TXD1 F2 ENET0_TXD2 G1 ENET0_TXD3 G2 Contact Signal Name Assignment LCD_D17 R3 LCD_D18 U4 LCD_D19 T4 LCD_D20 R4 LCD_D21 U5 LCD_D22 T5 LCD_D23 LCD_RD_E P4 LCD_RESET M6 LCD_RS LCD_WR_RWN K1 LRADC0 C15 LRADC1 C9 LRADC2 C8 LRADC3 D9 LRADC4 D13 LRADC5 D15 Freescale Semiconductor ...

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... P12 EMI_CE1N P9 EMI_CKE T13 EMI_CLK L17 EMI_CLKN L16 EMI_D00 N16 EMI_D01 M13 EMI_D02 P15 EMI_D03 N14 i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor Package Information and Contact Assignments Contact Signal Name Assignment ENET0_TX_CLK E3 ENET0_TX_EN F4 ENET_CLK E2 GPMI_ALE P6 GPMI_CE0N N7 GPMI_CE1N N9 GPMI_CE2N M7 ...

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... LCD_D09 P3 LCD_D10 R1 LCD_D11 R2 LCD_D12 T1 LCD_D13 T2 LCD_D14 U2 LCD_D15 U3 LCD_D16 T3 Contact Signal Name Assignment SSP2_MOSI C3 SSP2_SCK A3 SSP2_SS0 C4 SSP2_SS1 D3 SSP2_SS2 TESTMODE C10 USB0DM A10 USB0DP B10 USB1DM B8 USB1DP A8 VDD1P5 D16 VDD4P2 A13 VDD5V E17 XTALI A12 XTALO B12 Freescale Semiconductor ...

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... Table 66. 289-Pin i.MX281 MAPBGA Ball Map (continued) i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor Package Information and Contact Assignments 63 ...

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... Package Information and Contact Assignments Table 66. 289-Pin i.MX281 MAPBGA Ball Map (continued) 4.5 i.MX285 Ball Map Table 67 shows the 289-pin i.MX285 MAPBGA ball map. Table 67. 289-Pin i.MX285 MAPBGA Ball Map i.MX28 Applications Processors for Automotive Products, Rev Freescale Semiconductor ...

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... Table 67. 289-Pin i.MX285 MAPBGA Ball Map (continued) i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor Package Information and Contact Assignments 65 ...

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... Package Information and Contact Assignments Table 67. 289-Pin i.MX285 MAPBGA Ball Map (continued) i.MX28 Applications Processors for Automotive Products, Rev Freescale Semiconductor ...

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... MAPBGA Ball Map —289-pin i.MX283 MAPBGA Ball Map —289-pin i.MX286 MAPBGA Ball Map —289-pin i.MX287 MAPBGA Ball Map i.MX28 Applications Processors for Automotive Products, Rev. 3 Freescale Semiconductor Table 68. Document Revision History Substantive Change(s) Table 12, "Run IDD Test Case 5, updated the Ethernet MAC function. ...

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... Features.” Characteristics.” 1. Table 3, "i.MX28 Functions," on page Table 4, "i.MX28 Digital and Analog Modules," on page Table 8, "Recommended Power Supply Operating 12. Table 33, "Ethernet PLL Specifications," on page Table 34, "EMI Command/Address AC Timing," on page 12. 14. 20. 21. 28. 29. Freescale Semiconductor ...

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... Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “ ...