MCIMX285AJM4A Freescale Semiconductor, MCIMX285AJM4A Datasheet - Page 18

• Manufacturer Part Number: MCIMX285AJM4A
• Description: Processors - Application Specialized CATSKILLS REV 1.1
• Manufacturer: Freescale Semiconductor
• Type: Multimedia Applicationsr

Specifications of MCIMX285AJM4A

• Product Category: Processors - Application Specialized
• Core: ARM926EJ-S
• Processor Series: i.MX28
• Data Bus Width: 32 bit
• Data Ram Size: 128 KB
• Operating Supply Voltage: 1.35 V to 5.25 V
• Maximum Operating Temperature: + 85 C
• Memory Type: L1 Cache, ROM, SRAM

Electrical Characteristics
3.3
This section includes the DC parameters of the following I/O types:
3.3.1
Table 22
18
1
2
3
4
Junction to ambient
Junction to ambient
Junction to ambient
Junction to ambient
Junction to boards
Junction to case (top)
Junction to package top
Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-2 and JESD51-6. Thermal test board meets
JEDEC specification for this package.
Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC specification
for the specified package.
Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is
used for the case temperature. Reported value includes the thermal resistance of the interface layer.
Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
as Psi-JT.
•
•
•
•
•
•
Core via I.D: 0.068 mm, Core via plating 0.016 mm
Flag: trace style with ground balls under the die connected to the flag
Die Attach: 0.033 mm non-conductive die attach, k = 0.3 W/m K
Mold Compound: generic mold compound, k = 0.9 W/m K
DDR I/O: Mobile DDR (LPDDR1), standard 1.8 V DDR2, and low-voltage 1.5 V DDR2
(LVDDR2)
General purpose I/O (GPIO)
shows the EMI digital pin DC characteristics.
I/O DC Parameters
DDR I/O DC Parameters
The current values and the I-V curves of the I/O DC characteristics are
estimated based on an overly conservative device model. They are updated
upon the measurement results of the first silicon.
Rating
2
1
1
1
1
natural convection
natural convection
(@200 ft/min)
(@200 ft/min)
3
4
i.MX28 Applications Processors for Automotive Products, Rev. 3
Table 21. Thermal Resistance Data
Single layer board
(1s)
Four layer board (2s2p)
Single layer board
(1s)
Four layer board
(2s2p)
Natural Convection
NOTE
R
R
R
R
R
R
θ
Ψ
θ
θ
JCtop
θ
θ
θ
JMA
JMA
JT
JA
JA
JB
62
36
53
33
24
15
3
Freescale Semiconductor
Value
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit