PIC16F627A-I/SO Microchip Technology, PIC16F627A-I/SO Datasheet - Page 155

IC MCU FLASH 1KX14 EEPROM 18SOIC

PIC16F627A-I/SO

Manufacturer Part Number
PIC16F627A-I/SO
Description
IC MCU FLASH 1KX14 EEPROM 18SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F627A-I/SO

Program Memory Type
FLASH
Program Memory Size
1.75KB (1K x 14)
Package / Case
18-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Eeprom Size
128 x 8
Ram Size
224 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
224 B
Interface Type
SCI/USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
16
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT18SO-1 - SOCKET TRANSITION 18SOIC 300MILI3DBF648 - BOARD DAUGHTER ICEPIC3AC162053 - HEADER INTERFACE ICD,ICD2 18DIPAC164010 - MODULE SKT PROMATEII DIP/SOIC
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F627A-I/SO
Manufacturer:
ST
Quantity:
2 400
Part Number:
PIC16F627A-I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
PIC16F627A-I/SO
Quantity:
5 592
Part Number:
PIC16F627A-I/SO
0
28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body (QFN)
 2004 Microchip Technology Inc.
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC equivalent: M0-220
Drawing No. C04-114
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Base Thickness
Overall Width
Molded Package Width
Exposed Pad Width
Overall Length
Molded Package Length
Exposed Pad Length
Lead Width
Lead Length
Tie Bar Width
Tie Bar Length
Chamfer
Mold Draft Angle Top
A1
CH x 45
TOP VIEW
E1
E
Dimension Limits
n
Units
CH
D1
D2
A2
A1
A3
E1
E2
D
R
Q
A
E
B
n
p
L
2
1
D1
MIN
A2
.000
.140
.140
.009
.020
.005
.012
.009
Preliminary
D
A3
PIC16F627A/628A/648A
.008 REF.
INCHES
.026 BSC
.236 BSC
.226 BSC
.236 BSC
.226 BSC
A
NOM
D2
.0004
.033
.026
.146
.146
.011
.024
.007
.016
.017
28
R
EXPOSED
MAX
METAL
.039
.031
.002
.152
.152
.014
.030
.010
.026
.024
PADS
12
BOTTOM VIEW
MIN
E2
0.00
3.55
3.55
0.23
0.50
0.13
0.30
0.24
MILLIMETERS*
0.20 REF.
0.65 BSC
6.00 BSC
5.75 BSC
6.00 BSC
5.75 BSC
NOM
0.85
0.65
0.01
3.70
3.70
0.28
0.60
0.17
0.40
0.42
L
DS40044B-page 153
28
MAX
Q
B
p
1.00
0.80
0.05
3.85
3.85
0.35
0.75
0.23
0.65
0.60
12

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