PIC18F26K20-E/SP Microchip Technology, PIC18F26K20-E/SP Datasheet - Page 337
![IC PIC MCU FLASH 32KX16 28-DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC18F26K20-E/SP
Manufacturer Part Number
PIC18F26K20-E/SP
Description
IC PIC MCU FLASH 32KX16 28-DIP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC18F25K20T-ISS.pdf
(42 pages)
2.PIC18F25K20T-ISS.pdf
(456 pages)
3.PIC18F26K20-ISS.pdf
(6 pages)
4.PIC18F26K20-ISS.pdf
(10 pages)
5.PIC18F26K20-ISO.pdf
(430 pages)
Specifications of PIC18F26K20-E/SP
Program Memory Type
FLASH
Program Memory Size
64KB (32K x 16)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
24
Eeprom Size
1K x 8
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3936 B
Interface Type
CCP, ECCP, EUSART, I2C, MSSP, SPI
Maximum Clock Frequency
64 MHz
Number Of Programmable I/os
25
Number Of Timers
4
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 11 Channel
Package
28SPDIP
Device Core
PIC
Family Name
PIC18
Maximum Speed
64 MHz
Operating Supply Voltage
2.5|3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164112 - VOLTAGE LIMITER MPLAB ICD2 VPP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- PIC18F25K20T-ISS PDF datasheet
- PIC18F25K20T-ISS PDF datasheet #2
- PIC18F26K20-ISS PDF datasheet #3
- PIC18F26K20-ISS PDF datasheet #4
- PIC18F26K20-ISO PDF datasheet #5
- Current page: 337 of 430
- Download datasheet (7Mb)
LFSR
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
© 2008 Microchip Technology Inc.
Q Cycle Activity:
After Instruction
Decode
Decode
FSR2H
FSR2L
Q1
Read literal
Read literal
Load FSR
LFSR f, k
0 ≤ f ≤ 2
0 ≤ k ≤ 4095
k → FSRf
None
File Select Register pointed to by ‘f’.
2
2
The 12-bit literal ‘k’ is loaded into the
‘k’ MSB
‘k’ LSB
LFSR 2, 3ABh
1110
1111
Q2
=
=
03h
ABh
1110
0000
Process
Process
Data
Data
Q3
k
00ff
7
kkk
‘k’ to FSRfL
Write literal
literal ‘k’
MSB to
FSRfH
Write
k
Q4
kkkk
11
kkk
Preliminary
MOVF
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
PIC18F2XK20/4XK20
Q Cycle Activity:
Before Instruction
After Instruction
Decode
REG
W
REG
W
Q1
register ‘f’
Move f
MOVF
0 ≤ f ≤ 255
d ∈ [0,1]
a ∈ [0,1]
f → dest
N, Z
The contents of register ‘f’ are moved to
a destination dependent upon the
status of ‘d’. If ‘d’ is ‘0’, the result is
placed in W. If ‘d’ is ‘1’, the result is
placed back in register ‘f’ (default).
Location ‘f’ can be anywhere in the
256-byte bank.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f ≤ 95 (5Fh). See
Section 24.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
1
1
MOVF
Read
0101
Q2
=
=
=
=
22h
FFh
22h
22h
f {,d {,a}}
REG, 0, 0
00da
Process
Data
Q3
DS41303D-page 335
ffff
Write W
Q4
ffff
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