DSPIC33FJ64MC202-I/SP Microchip Technology, DSPIC33FJ64MC202-I/SP Datasheet - Page 145
![IC DSPIC MCU/DSP 64K 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
DSPIC33FJ64MC202-I/SP
Manufacturer Part Number
DSPIC33FJ64MC202-I/SP
Description
IC DSPIC MCU/DSP 64K 28DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ32MC202-IMM.pdf
(14 pages)
2.DSPIC33FJ32MC302-ISO.pdf
(436 pages)
3.DSPIC33FJ64MC202-ESO.pdf
(424 pages)
Specifications of DSPIC33FJ64MC202-I/SP
Program Memory Type
FLASH
Program Memory Size
64KB (64K x 8)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
21
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Data Ram Size
8 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- DSPIC33FJ32MC202-IMM PDF datasheet
- DSPIC33FJ32MC302-ISO PDF datasheet #2
- DSPIC33FJ64MC202-ESO PDF datasheet #3
- Current page: 145 of 424
- Download datasheet (6Mb)
9.0
The dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/
X04 and dsPIC33FJ128MCX02/X04 oscillator system
provides:
FIGURE 9-1:
© 2009 Microchip Technology Inc.
SOSCO
SOSCI
Note 1: This data sheet summarizes the features
Note 1: See Figure 9-2 for PLL details.
R
(2)
2: Some registers and associated bits
2:
OSCILLATOR CONFIGURATION
OSC1
OSC2
Secondary Oscillator
of
dsPIC33FJ64MCX02/X04
dsPIC33FJ128MCX02/X04
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to “Section 39. Oscillator
(Part III)” (DS70216) of the “dsPIC33F/
PIC24H
which is available from the Microchip
website (www.microchip.com).
described in this section may not be avail-
able on all devices. Refer to Section 4.0
“Memory Organization” in this data
sheet for device-specific register and bit
information.
If the Oscillator is used with XT or HS modes, an external parallel resistor with the value of 1 MΩ must be connected.
Primary Oscillator
Oscillator
Oscillator
TUN<5:0>
LPRC
FRC
POSCMD<1:0>
the
dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/
X04 OSCILLATOR SYSTEM DIAGRAM
Family
LPOSCEN
dsPIC33FJ32MC302/304,
Auxiliary Oscillator
Reference
POSCCLK
S1
÷ 16
S3
family
FRCDIV<2:0>
Manual”,
AOSCMD<1:0>
POSCCLK
AOSCCLK
and
Preliminary
of
PLL
ASRCSEL
XTPLL, HSPLL,
ECPLL, FRCPLL
• External and internal oscillator options as clock
• An on-chip Phase-Locked Loop (PLL) to scale the
• An internal FRC oscillator that can also be used
• Clock switching between various clock sources
• Programmable clock postscaler for system power
• A Fail-Safe Clock Monitor (FSCM) that detects
• A Clock Control register (OSCCON)
• Non-volatile Configuration bits for main oscillator
• An auxiliary crystal oscillator for audio DAC
A simplified diagram of the oscillator system is shown
in Figure 9-1.
F
VCO (1)
Clock Fail
sources
internal operating frequency to the required
system clock frequency
with the PLL, thereby allowing full-speed
operation without any external clock generation
hardware
savings
clock failure and takes fail-safe measures
selection.
XT, HS, EC
FRCDIV16
FRCDIVN
S7
F
LPRC
S
FRC
VCO (1)
OSC
Clock Switch
S1/S3
S7
S0
S5
S4
S2
S6
SELACK
NOSC<2:0>
÷ 2
Reset
DOZE<2:0>
FNOSC<2:0>
÷ N
APSTSCLR<2:0>
DS70291D-page 145
ACLK
Timer1
WDT,
PWRT,
FSCM
DAC
F
F
F
OSC
CY
P
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