DSPIC33FJ64MC202-I/SP Microchip Technology, DSPIC33FJ64MC202-I/SP Datasheet - Page 366
![IC DSPIC MCU/DSP 64K 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
DSPIC33FJ64MC202-I/SP
Manufacturer Part Number
DSPIC33FJ64MC202-I/SP
Description
IC DSPIC MCU/DSP 64K 28DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ32MC202-IMM.pdf
(14 pages)
2.DSPIC33FJ32MC302-ISO.pdf
(436 pages)
3.DSPIC33FJ64MC202-ESO.pdf
(424 pages)
Specifications of DSPIC33FJ64MC202-I/SP
Program Memory Type
FLASH
Program Memory Size
64KB (64K x 8)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
21
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Data Ram Size
8 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- DSPIC33FJ32MC202-IMM PDF datasheet
- DSPIC33FJ32MC302-ISO PDF datasheet #2
- DSPIC33FJ64MC202-ESO PDF datasheet #3
- Current page: 366 of 424
- Download datasheet (6Mb)
FIGURE 31-14:
TABLE 31-32: SPIx MASTER MODE (CKE = 0) TIMING REQUIREMENTS
DS70291D-page 366
AC CHARACTERISTICS
SP10
SP11
SP20
SP21
SP30
SP31
SP35
SP40
SP41
Note 1:
Param
No.
Note: Refer to Figure 31-1 for load conditions.
(CKP = 0)
(CKP = 1)
SDIx
SCKx
SDOx
SCKx
2:
3:
4:
TdoF
TdoR
TscL
TscH
TscF
TscR
TscH2doV,
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
Symbol
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
The minimum clock period for SCKx is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
Assumes 50 pF load on all SPIx pins.
SPIx MODULE MASTER MODE (CKE = 0) TIMING CHARACTERISTICS
SCKx Output Low Time
SCKx Output High Time
SCKx Output Fall Time
SCKx Output Rise Time
SDOx Data Output Fall Time
SDOx Data Output Rise Time
SDOx Data Output Valid after
SCKx Edge
Setup Time of SDIx Data Input
to SCKx Edge
Hold Time of SDIx Data Input
to SCKx Edge
Characteristic
SP35
SP31
SP11
SP40 SP41
MSb In
MSb
SP10
(1)
Preliminary
Bit 14 - - - -1
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Bit 14 - - - - - -1
T
T
Min
CY
CY
23
30
—
—
—
—
—
/2
/2
SP21
SP20
Typ
—
—
—
—
—
—
—
—
6
(2)
SP30
SP20
SP21
Max
LSb In
20
LSb
—
—
—
—
—
—
—
—
-40°C ≤ T
-40°C ≤ T
Units
© 2009 Microchip Technology Inc.
ns
ns
ns
ns
ns
ns
ns
ns
ns
A
A
≤ +85°C for Industrial
≤ +125°C for Extended
See parameter D031
See Note 3
See Note 3
See parameter D032
and Note 4
and Note 4
See parameter D032
and Note 4
See parameter D031
and Note 4
Conditions
—
—
—
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