LPC3250FET296/01,5 NXP Semiconductors, LPC3250FET296/01,5 Datasheet - Page 58

IC ARM9 MCU 256K 296-TFBGA

LPC3250FET296/01,5

Manufacturer Part Number
LPC3250FET296/01,5
Description
IC ARM9 MCU 256K 296-TFBGA
Manufacturer
NXP Semiconductors
Series
LPC32x0r
Datasheets

Specifications of LPC3250FET296/01,5

Package / Case
296-TFBGA
Core Processor
ARM9
Core Size
16/32-Bit
Speed
266MHz
Connectivity
EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, Motor Control PWM, PWM, WDT
Number Of I /o
51
Program Memory Type
ROMless
Ram Size
256K x 8
Voltage - Supply (vcc/vdd)
0.9 V ~ 3.6 V
Data Converters
A/D 3x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC32
Core
ARM926EJ-S
Data Bus Width
32 bit
Data Ram Size
256 KB
Interface Type
EMC
Maximum Clock Frequency
266 MHz
Number Of Timers
6
Operating Supply Voltage
1.31 V to 1.39 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, DK-57TS-LPC3250, DK-57VTS-LPC3250, SOMDIMM-LPC3250
Development Tools By Supplier
OM11016, OM11021, OM11045
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 3 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4962
935290766551

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC3250FET296/01,5
Manufacturer:
TI
Quantity:
250
Part Number:
LPC3250FET296/01,5
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Part Number:
LPC3250FET296/01,5
Manufacturer:
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Quantity:
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Part Number:
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Quantity:
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NXP Semiconductors
Table 15.
T
[1]
[2]
LPC3220_30_40_50_1
Preliminary data sheet
Symbol Parameter
T
t
t
t
t
su(D)
h(D)
d(QV)
h(Q)
amb
cy(clk)
Parameters are valid over operating temperature range unless otherwise specified.
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
= 40 C to +85 C for industrial applications; V
clock cycle time
data input set-up time
data input hold time
data output valid delay time
data output hold time
Dynamic characteristics: SD card pin interface
11.7 Secure Digital (SD) card interface
Fig 13. USB bus turnaround time
Fig 14.
USB_SE0_VM
SD card pin interface timing
USB_DAT_VP
USB_OE_TP
Conditions
on pin MS_SCLK; Data transfer mode
on pin MS_SCLK; Identification mode
on pins MS_BS, MS_DIO[3:0] as inputs
on pins MS_BS, MS_DIO[3:0] as inputs
on pins MS_BS, MS_DIO[3:0] as outputs
on pins MS_BS, MS_DIO[3:0] as outputs
MS_DIO[3:0](O)
MS_DIO[3:0] (I)
MS_BS (O)
MS_SCLK
MS_BS (I)
Rev. 01 — 6 February 2009
DD(IO)
input
over specified ranges.
t
TIO
t
d(QV)
T
cy(clk)
output
[1]
LPC3220/30/40/50
t
su(D)
t
TOI
16/32-bit ARM microcontrollers
Min
-
-
-
-
-
-
t
t
h(D)
h(Q)
002aae441
Typ
-
-
2.7
0
9.7
7.7
input
[2]
© NXP B.V. 2009. All rights reserved.
002aae440
Max
25
400
-
-
-
-
Unit
MHz
ns
ns
ns
ns
kHz
58 of 73

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